Vibration testing and analysis of ball grid array package solder joints

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 373-380

  Wong, Shaw Fong ^a   Malatkar, Pramod ^a   Rick, Canham ^a   Kulkami, Vijay ^a   Chin, Ian ^a  

^a Intel Technology Malaysia Sdn Bhd   (Malaysia)

Author keywords

[No Author keywords available]

Indexed keywords

CHARACTERIZATION; FATIGUE OF MATERIALS; RELIABILITY THEORY; SOLDERED JOINTS; STRAIN; STRESS ANALYSIS; VIBRATION ANALYSIS;

DATA POINTS; MINER'S CUMULATIVE DAMAGE THEORY; NUMBER-OF-CYCLES-TO-FAILURE; VIBRATION LOADING;

BALL GRID ARRAYS;

EID: 35348894354     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373825     Document Type: Conference Paper

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