Creep rupture of lead-free Sn-3.5Ag and Sn-3.5Ag-0.5Cu solders

Journal of Materials Science: Materials in Electronics

Volumn 16, Issue 6, 2005, Pages 355-365

  Lin, Chih Kuang ^a   Chu, De You ^a  

^a NATIONAL CENTRAL UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BINARY ALLOYS; CREEP; EUTECTICS; FRACTOGRAPHY; INTERMETALLICS; SOLDERING ALLOYS; STRAIN RATE; TENSILE STRENGTH; TENSILE STRESS; TERNARY SYSTEMS; THERMAL EFFECTS; VOLUME FRACTION;

CREEP RESISTANCE; CREEP RUPTURE; LEAD FREE SOLDERS;

TIN ALLOYS;

EID: 22144436685     PISSN: 09574522     EISSN: None     Source Type: Journal    
DOI: 10.1007/s10854-005-1147-5     Document Type: Article

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