Integrated numerical-experimental analysis of interfacial fatigue fracture in SnAgCu solder joints

International Journal of Solids and Structures

Volumn 44, Issue 17, 2007, Pages 5680-5694

  Erinc, M ^a   Schreurs, P J G ^a   Geers, M G D ^a  

^a EINDHOVEN UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

Cohesive zone modeling; Lead free solder; Low cycle fatigue

Indexed keywords

COHESIVE ZONE MODELING; LEAD-FREE SOLDER; LOW-CYCLE FATIGUE;

BALL GRID ARRAYS; COMPUTER SIMULATION; ELECTRONICS PACKAGING; FATIGUE CRACK PROPAGATION; PARAMETER ESTIMATION; TIN ALLOYS;

SOLDERED JOINTS;

EID: 34447292862     PISSN: 00207683     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijsolstr.2007.01.021     Document Type: Article

References (27)

1. Abdul-Baqi A., Schreurs P.J.G., and Geers M.G.D. Fatigue damage modeling in solder interconnects using a cohesive zone approach. International Journal of Solids and Structures 42 (2005) 927-942
2. Abtew M., and Seldavuray G. Lead-free solders in microelectronics. Materials Science and Engineering R 27 (2000) 95-141
3. Allen S.L., Notis M.R., Chromik R.R., and Vinci R.P. Microstructural evolution in lead-free solder alloys: Part 1. Cast Sn-Ag-Cu eutectic. Journal of Materials Research 19 (2004) 1417-1431
4. Aramis v 5.3.0 User's Manual, 2004. GOM GmbH, Gesellschaft fur Optische Messtechniek.
5. Barenblatt G.I. The mathematical theory of equilibrium cracks in brittle fracture. Advances in Applied Mechanics VII (1962) 55-129
6. Chaboche J.L., Feyel F., and Monerie Y. Interface debonding models: a viscous regularization with a limited rate dependency. International Journal of Solids and Structures 38 (2001) 3127-3160
7. de-Andres A., Perez J.L., and Ortiz M. Elastoplastic finite element analysis of three-dimensional fatigue crack growth in aluminum shafts subjected to axial loading. International Journal of Solids and Structures 36 (1999) 2231-2258
8. Dugdale D.S. Yielding in steel sheets containing slits. Journal of the Mechanics and Physics of Solids 8 (1960) 100-104
9. Erinc M., Schreurs P.J.G., Zhang G.Q., and Geers M.G.D. Characterization and fatigue damage simulation in SAC solder joints. Microelectronics Reliability 44 (2004) 1287-1292
10. Erinc M., Schreurs P.J.G., Zhang G.Q., and Geers M.G.D. Microstructural damage analysis of SnAgCu solder joints and an assessment on indentation procedures. Journal of Materials Science: Materials in Electronics 16 (2005) 93-700
11. 4 metal matrix composite. Mechanics of Materials 29 (1998) 53-68
12. 4 intermetallic compounds in the solder bump. Journal of Electronics Materials 33 (2004) 1103-1110
13. Lee W.W., Nguyen L.T., and Selvaduray G.S. Solder joint fatigue models: review and applicability to chip scale packages. Microelectronics Reliability 40 (2000) 231-244
14. Lin C.K., and Chu D.Y. Creep rupture of lead-free Sn-3.5Ag and Sn-3.5Ag-0.5Cu solders. Journal of Materials Science: Materials in Electronics 16 (2005) 355-365
15. Matin, M.A., 2005. Microstructure evolution and thermo-mechanical fatigue of solder materials. Ph.D Thesis, Technische Universiteit Eindhoven, ISBN 90-386-2887-0.
16. Metals Handbook, 1985. 9th ed., Mechanical Testing, vol.8. Fatigue Testing, 361-437.
17. Needleman A. An analysis of decohesion along an imperfect interface. International Journal of Fracture 42 (1990) 21-40
18. Ratchev P., Vandevelde B., and de Wolf I. Reliability and failure analysis of Sn-Ag-Cu solder interconnections for PSGA packages on Ni/Au surface finish. IEEE Transactions on Device and Materials Reliability 4 (2004) 5-10
19. Roe K.L., and Siegmund T. An irreversible cohesive zone model for interface fatigue crack growth simulation. Engineering Fracture Mechanics 70 (2003) 209-232
20. Sharif A., and Chan Y.C. Interfacial reactions of Sn-3.5%Ag and Sn-3.5%Ag-0.5%Cu solder with electroless Ni/Au metallization during multiple reflow cycles. Journal of Materials Science: Materials in Electronics 16 (2005) 153-158
21. Towashiraporn P., Subbarayan G., and Desai C.S. A hybrid model for computationally efficient fatigue fracture simulations at microelectronic assembly interfaces. International Journal of Solids and Structures 42 (2005) 4468-4483
22. Van den Bosch M.J., Schreurs P.J.G., and Geers M.G.D. An improved description of the exponential Xu and Needleman cohesive zone law for mixed-mode decohesion. Engineering Fracture Mechanics 73 (2006) 1220-1234
23. Visser, J.W.W., 2002. Microstructure and deformation analysis of lead-free solder joints. Technische Universiteit Eindhoven, MT02.12.
24. Wiese S., and Wolter K.-J. Microstructure and creep behaviour of eutectic SnAg and SnAgCu solders. Microelectronics Reliability 44 (2004) 1923-1931
25. Wiese S., Feustel F., and Meusel E. Characterisation of constitutive behaviour of SnAg, SnAgCu and SnPb solder in flip chip solder joints. Sensors and Actuators A 99 (2002) 188-193
26. Yoon J., Kim S., and Jung S. IMC morphology, interfacial reaction and joint reliability of Pb-free Sn-Ag-Cu solder on electrolytic Ni BGA substrate. Journal of Alloys and Compounds 392 (2005) 247-252
27. Zeng K., Vuorinen V., and Kivilahti J.K. Interfacial reactions between lead-free SnAgCu solder and Ni(P) surface finish on printed circuit boards. IEEE Transactions on Electronics Packaging Manufacturing 25 (2002) 162-167