A coupled numerical and experimental study on thermo-mechanical fatigue failure in SnAgCu solder joints

EuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007

Volumn , Issue , 2007, Pages

  Erinc, M ^a   Schreurs, P J G ^a   Geers, M G D ^a  

^a EINDHOVEN UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPY; CRACKS; FATIGUE CRACK PROPAGATION; FATIGUE DAMAGE; MICROSTRUCTURE; THERMAL FATIGUE; TIN COMPOUNDS;

BONDING INTERFACE; COHESIVE ZONE LAW; INTRINSIC THERMAL ANISOTROPY;

SOLDERED JOINTS;

EID: 36348964836     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2007.359928     Document Type: Conference Paper

References (25)

1. Matin, M.A. Microstructure evolution and thermomechanical fatigue of solder materials. Ph.D Thesis, Technische Universiteit Eindhoven, ISBN 90-386-2887-0, 2005.
2. Abtew, M., Seldavuray, G., Mat.Sci.Eng.R 27:95-141, 2000.
3. Zeng, K., Tu, K.N. Mat.Sci.Eng.R 38:55-105, 2002.
4. Laurila, T., Vuorinen, V., Kivilahti, J.K. Mat.Sci.Eng.R 49:1-60, 2005.
5. Zeng, K., Vuorinen, V., Kivilahti, J.K. IEEE T Electron Pa M 25:162-167, 2002.
6. Ratchev, P., Vandevelde, B., deWolf, I. IEEE T Device and Materials Reliability 4:5-10, 2004.
7. Sharif, A., Chan, Y.C. J Mater Sci Mater El 16:153158, 2005.
8. Yoon. J., Kim, S., Jung, S. J Alloy Compd 392:247-252, 2005.
9. Erinc, M., Schreurs, P.J.G., Zhang, G.Q., Geers, M.G.D. J Mater Sci Mater El 16:93-700, 2005.
10. Erinc, M., Schreurs, P.J.G., Zhang, G.Q., Geers, M.G.D. Microelectron Reliab 44:1287-1292, 2004.
11. Wiese, S., Feustel, F., Meusel, E. Sensor Actuator A 99:188-193, 2002.
12. Wiese, S. Wolter, K.-J. Microelectron Reliab 44:1923-1931, 2004.
13. Lin, C.K., Chu, D.Y. J Mater Sci Mater Electron 16:355-365, 2005.
14. Lee, W.W., Nguyen, L.T., Selvaduray, G.S. Microelectron Reliab 40:231-244, 2000.
15. Towashiraporn, P., Subbarayan, G., Desai, C.S. Int J Solids Struct 42:4468-4483, 2005.
16. Erinc M, Schreurs, P.J.G, Geers, M.G.D, Int J Solids Struct, In Press, 2007.
17. Matin, A.,Coenen, E.W.C., Vellinga, W.P., Geers, M.G.D. Scripta Mater, 53:8, 927-932, 2005.
18. Subramanian, K.N., Lee, J.G. J Mater Sci Mater El 15:235-240, 2004.
19. Telang, A.U., Bieler, T.R., Lucas, J.P., Subramanian, K.N., Lehman, L.P., Xing, Y., Cotts, E.J., 2004. J Electron Mater 33(12), 1412-1423.
20. Vianco, P.T., Rejent, J.A., Kilgo, A.C. J Electron Mater, 33(12), 1473-1484, 2004.
21. Erinc,M, Schreurs, P.J.G, Geers, M.G.D. Proc. 7th World Congress on Computational Mechanics, Los Angeles, 2006.
22. Roe, K.L., Siegmund,T., Eng Fract Mech 70:209-232, 2003.
23. Abdul-Baqi, A.,; Schreurs, P.J.G., Geers, M.G.D. Int J Solids Struct 42:927-942, 2005.
24. Jang, G.Y., Lee, J.W., Duh, J.G., J Electron Mater 33:1103-1110, 2004.
25. Ubachs, R.L.J.M. Thermomechanical modelling of mierostructure evolution in solder alloys. Ph.D Thesis, Technische Universiteit Eindhoven, ISBN 90-386-2967-2, 2005.