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Volumn 6921, Issue , 2008, Pages

Flare evaluation for 32-nm half pitch using SFET

Author keywords

32 nm half pitch node; EUVL; Flare; Gaussian function; Point spread function; Resist blur; Rigorous simulation

Indexed keywords

32-NM HALF-PITCH NODE; FLARE; GAUSSIAN FUNCTIONS; POINT-SPREAD FUNCTION; RESIST BLUR; RIGOROUS SIMULATION;

EID: 45549102787     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.771857     Document Type: Conference Paper
Times cited : (28)

References (17)
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  • 8
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    • Determination of the flare specification and methods to meet the CD control requirements for the 32 nm node using EUVL
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    • Flare-variation compensation for 32 nm line and space pattern for device manufacturing on extream-ultraviolet lithography
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    • Modeling of EUV photoresists with a resist point spread function
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  • 14
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    • Effects of aberration and flare on the lithographic performance of SFET
    • to be published [6921-132]
    • Y. Tanaka, H. Aoyama, K. Tawarayama, S. Magoshi, S. Shirai, and H. Tanaka, "Effects of aberration and flare on the lithographic performance of SFET", Proc. SPIE 6921(2008), to be published [6921-132].
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  • 15
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    • The effect of localized mask density variations on image quality in EUV lithography
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.