Thick and low-stress PECVD amorphous silicon for MEMS applications

Journal of Micromechanics and Microengineering

Volumn 18, Issue 1, 2008, Pages

  Iliescu, Ciprian ^a   Chen, Bangtao ^a  

^a INSTITUTE OF BIOENGINEERING AND NANOTECHNOLOGY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

AMORPHOUS SILICON; MEMS; PARAMETER ESTIMATION; SILANES; WET ETCHING;

FREQUENCY MODE; PROCESS PARAMETERS;

PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION;

EID: 41949088362     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/18/1/015024     Document Type: Article

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