메뉴 건너뛰기




Volumn 133, Issue 2 SPEC. ISS., 2007, Pages 395-400

Strategies in deep wet etching of Pyrex glass

Author keywords

Masking layer; Residual stress; Wet etching of glass

Indexed keywords

ANNEALING; CONCENTRATION (PROCESS); DEGRADATION; ETCHING; HYDROPHILICITY; RESIDUAL STRESSES;

EID: 33846516959     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2006.06.044     Document Type: Article
Times cited : (82)

References (14)
  • 3
    • 0037439263 scopus 로고    scopus 로고
    • Microfabricated device for DNA and RNA amplification by continuous-flow polymerase chain reaction and reverse transcription-polymerase chain reaction with cycle number selection
    • Obeid P.J., Christopoulos T.K., Crabtree H.J., and Backhouse C.J. Microfabricated device for DNA and RNA amplification by continuous-flow polymerase chain reaction and reverse transcription-polymerase chain reaction with cycle number selection. Anal. Chem. 75 (2003) 288-295
    • (2003) Anal. Chem. , vol.75 , pp. 288-295
    • Obeid, P.J.1    Christopoulos, T.K.2    Crabtree, H.J.3    Backhouse, C.J.4
  • 4
    • 15544362224 scopus 로고    scopus 로고
    • Fabrication of a dielectrophoretic chip with 3D silicon electrodes
    • Iliescu C., Xu G.L., Samper V., and Tay F.E.H. Fabrication of a dielectrophoretic chip with 3D silicon electrodes. J. Micromech. Microeng. 15 (2005) 494-500
    • (2005) J. Micromech. Microeng. , vol.15 , pp. 494-500
    • Iliescu, C.1    Xu, G.L.2    Samper, V.3    Tay, F.E.H.4
  • 5
    • 0036906239 scopus 로고    scopus 로고
    • Fabrication of high-density electrical feed-throughs by deep-reactive-ion etching of Pyrex glass
    • Li X., Abe T., and Esashi M. Fabrication of high-density electrical feed-throughs by deep-reactive-ion etching of Pyrex glass. J. Microelectromech. Syst. 1-6 (2002) 625-630
    • (2002) J. Microelectromech. Syst. , vol.1 , Issue.6 , pp. 625-630
    • Li, X.1    Abe, T.2    Esashi, M.3
  • 6
    • 0032021451 scopus 로고    scopus 로고
    • Method for fabrication of microfluidic systems in glass
    • Stjernström M., and Roeraade J. Method for fabrication of microfluidic systems in glass. J. Micromech. Microeng. 8 (1998) 33-38
    • (1998) J. Micromech. Microeng. , vol.8 , pp. 33-38
    • Stjernström, M.1    Roeraade, J.2
  • 7
    • 0035337220 scopus 로고    scopus 로고
    • Deep wet etching of fused silica glass for hallows capillary optical leaky waveguides in microfluidic devices
    • Grosse A., Grewe M., and Fouckhardt H. Deep wet etching of fused silica glass for hallows capillary optical leaky waveguides in microfluidic devices. J. Micromech. Microeng. 11 (2001) 257-262
    • (2001) J. Micromech. Microeng. , vol.11 , pp. 257-262
    • Grosse, A.1    Grewe, M.2    Fouckhardt, H.3
  • 9
    • 0031648043 scopus 로고    scopus 로고
    • Low-temperature anodic bonding using lithium aluminosilicate-β-quartz glass ceramic
    • Shoji S., Kikuchi H., and Torigoe H. Low-temperature anodic bonding using lithium aluminosilicate-β-quartz glass ceramic. Sens. Actuators A 64 (1997) 95-100
    • (1997) Sens. Actuators A , vol.64 , pp. 95-100
    • Shoji, S.1    Kikuchi, H.2    Torigoe, H.3
  • 10
    • 4544233318 scopus 로고    scopus 로고
    • A new masking technology for deep glass etching and its microfluidic application
    • Bu M., Melvin T., Ensell G.J., Wilkinson J.S., and Evans A.G.R. A new masking technology for deep glass etching and its microfluidic application. Sens. Actuators A 115 2-3 (2004) 476-482
    • (2004) Sens. Actuators A , vol.115 , Issue.2-3 , pp. 476-482
    • Bu, M.1    Melvin, T.2    Ensell, G.J.3    Wilkinson, J.S.4    Evans, A.G.R.5
  • 11
    • 69749109847 scopus 로고    scopus 로고
    • Stress control in masking layers for deep wet micromachining of Pyrex glass
    • Iliescu C., Miao J., and Tay F.E.H. Stress control in masking layers for deep wet micromachining of Pyrex glass. Sens. Actuators A 117 2 (2005) 286-292
    • (2005) Sens. Actuators A , vol.117 , Issue.2 , pp. 286-292
    • Iliescu, C.1    Miao, J.2    Tay, F.E.H.3
  • 13
    • 0032090541 scopus 로고    scopus 로고
    • Deep wet etching of borosilicate glass using anodically bonded silicon substrate as mask
    • Corman T., Enokson P., and Stemme G. Deep wet etching of borosilicate glass using anodically bonded silicon substrate as mask. J. Micromech. Microeng. 8 (1998) 84-87
    • (1998) J. Micromech. Microeng. , vol.8 , pp. 84-87
    • Corman, T.1    Enokson, P.2    Stemme, G.3
  • 14
    • 15544373657 scopus 로고    scopus 로고
    • Characterization of masking layers for deep wet etching of glass in an improved HF/HCl solution
    • Iliescu C., Ji J., Tay F.E.H., Miao J., and Sun T.T. Characterization of masking layers for deep wet etching of glass in an improved HF/HCl solution. Surf. Coat. Technol. 198 1-3 (2005) 314-318
    • (2005) Surf. Coat. Technol. , vol.198 , Issue.1-3 , pp. 314-318
    • Iliescu, C.1    Ji, J.2    Tay, F.E.H.3    Miao, J.4    Sun, T.T.5


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.