One-mask process for silicon accelerometers on Pyrex glass utilising notching effect in inductively coupled plasma DRIE

Electronics Letters

Volumn 39, Issue 8, 2003, Pages 658-659

  Iliescu, C ^a   Miao, J ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ANODIC OXIDATION; BONDING; GLASS; INDUCTIVELY COUPLED PLASMA; MICROMACHINING; REACTIVE ION ETCHING; SILICON WAFERS; SUBSTRATES;

DEEP REACTIVE ION ETCHING (DRIE);

ACCELEROMETERS;

EID: 0037666374     PISSN: 00135194     EISSN: None     Source Type: Journal    
DOI: 10.1049/el:20030407     Document Type: Article

References (4)

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2. FU, L., MIAO, J.M. LI, N. N., and LIN, R.M.: 'Study of deep silicon etching for micro-gyroscope fabrication', Appl. Surf. Sci., 2001, 177, (1-2) pp. 78-84
3. AYON, A.A. ISHIHARA, K., BRAFE, R.A., SAWIN, H.H. and SCHMIDT, M.A.: Microfabrication and testing of suspended structures compatible withsilicon-on-insulator technology', J. Vac. Sci. Technol. B. Microelectron. Nanometer Struct., 1999, 17, (4), pp. 1589-1593
4. McAUEEY, S.A., ASHRAE, H., ATABO, L., CHAMBERS, A., HALI, S. HOPKINS, J., and NICHOLES, G.: 'Silicon micromachining using a high density plasma source', J. Phys. D: Appl. Phys. 2001, 34, pp. 2769 2771