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Volumn 8, Issue 6, 2007, Pages 76-88

RF MEMS testing-beyond the S-parameters

Author keywords

[No Author keywords available]

Indexed keywords

BIAS TREES; DIODE DETECTORS; S-PARAMETER DATA; SWITCH PARAMETERS;

EID: 37349030362     PISSN: 15273342     EISSN: None     Source Type: Trade Journal    
DOI: 10.1109/MMM.2007.907737     Document Type: Article
Times cited : (10)

References (23)
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  • 8
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    • Muldavin, J.B.1    Rebeiz, G.M.2
  • 9
    • 0035686946 scopus 로고    scopus 로고
    • Nonlinear electro-mechanical modeling of MEMS switches
    • Digest, Phoenix, AZ, pp
    • J.B. Muldavin and G.M. Rebeiz, "Nonlinear electro-mechanical modeling of MEMS switches," 2001 IEEE MTT-S M. Microwave Symp. Digest, Phoenix, AZ, pp. 2119-2122.
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    • Muldavin, J.B.1    Rebeiz, G.M.2
  • 11
    • 0141988710 scopus 로고    scopus 로고
    • Noncontact measurement of charge induced voltage shift in capacitive MEM-switches
    • Sept
    • J.R. Reid, R.T. Webster, and L.A. Starman, "Noncontact measurement of charge induced voltage shift in capacitive MEM-switches," IEEE Microwave Wireless Components Lett., vol. 13, no. 9, pp. 367-369, Sept. 2003.
    • (2003) IEEE Microwave Wireless Components Lett , vol.13 , Issue.9 , pp. 367-369
    • Reid, J.R.1    Webster, R.T.2    Starman, L.A.3
  • 14
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    • Oct
    • C.L. Goldsmith and D.I. Forehand, "Temperature variation of actuation voltage in capacitive MEMS switches," IEEE Microwave Wireless Comp. Lett., vol. 15, no. 10, pp. 718-720, Oct. 2005.
    • (2005) IEEE Microwave Wireless Comp. Lett , vol.15 , Issue.10 , pp. 718-720
    • Goldsmith, C.L.1    Forehand, D.I.2
  • 17
    • 32844473601 scopus 로고    scopus 로고
    • Wafer level micropackaging for RF MEMS Switches
    • San Francisco, CA, July, CD-Rom
    • D. Forehand and C. Goldsmith, "Wafer level micropackaging for RF MEMS Switches," in Proc. 2005 ASME InterPACK Conf, San Francisco, CA, July 2005 [CD-Rom].
    • (2005) Proc. 2005 ASME InterPACK Conf
    • Forehand, D.1    Goldsmith, C.2
  • 18
    • 2942511587 scopus 로고    scopus 로고
    • Fabrication and accelerated hermeticity testing of an on-wafer package for RF MEMS
    • June
    • A. Margomenos and L.P.B. Katehi, "Fabrication and accelerated hermeticity testing of an on-wafer package for RF MEMS," IEEE Trans. Microwave Theory Tech., vol. 52, no.6, pp.1626-1636, June 2004.
    • (2004) IEEE Trans. Microwave Theory Tech , vol.52 , Issue.6 , pp. 1626-1636
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  • 21
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    • RF MEMS: Ready for prime time
    • Feb
    • J. McKillop, "RF MEMS: Ready for prime time," Microwave J., vol. 50, no. 2, p. 24, Feb. 2007.
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.