Design, performance and qualification of a commercially available MEMS switch

Proceedings of the 36th European Microwave Conference, EuMC 2006

Volumn , Issue , 2006, Pages 1399-1401

  McKillop, John ^a   Fowler, Thomas ^a   Goins, David ^a   Nelson, Richard ^a  

^a TeraVicta Technologies Inc   (United States)

Author keywords

Broadband; MEMS; Ohmic contacts; Reliability; RF; Switches

Indexed keywords

BROADBAND NETWORKS; MEMS; OHMIC CONTACTS; RELIABILITY ANALYSIS;

MEMS SWITCHES; PACKAGE CONSTRUCTION; PROPRIETARY HIGH FORCE DISK ACTUATORS;

ELECTRIC SWITCHES;

EID: 41649108098     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EUMC.2006.281298     Document Type: Conference Paper

References (4)

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3. K. F. Harsh, W. Zhang, V. M. Bright, and Y. C. Lee, "Flip-Chip Assembly for Si-Based RF MEMS," Proceedings of the 1999 IEEE International Conference on Microelectromechanical Systems (MEMS '99), Orlando, FL, pp. 273-278, January 17-21, 1999
4. S. Majumder, N.E. McGruer, G.G. Adams, P.M. Zavracky, R.H. Morrison, and J. Krim, " Study of Contacts in an Electrostatically Actuated Microswitch," Sensors and Actuators, Vol. A93, 2001, pp. 19-26.