Wafer level micropackaging for RF MEMS switches

Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005

Volumn PART C, Issue , 2006, Pages 2047-2051

  Forehand, David I ^a   Goldsmith, Charles L ^a  

^a MEMtronics Inc   (United States)

Author keywords

Hermeticity; Humiticity; Low loss; Packaging; RF MEMS; Wafer level

Indexed keywords

COST EFFECTIVENESS; ELECTRIC SWITCHES; ENCAPSULATION; MICROELECTROMECHANICAL DEVICES; WSI CIRCUITS;

HERMETICITY; HUMITICITY; LOW LOSS; MICROPACKAGING; WAFER-LEVEL;

ELECTRONICS PACKAGING;

EID: 32844473601     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. David I. Forehand, "Low Temperature Wafer-Level Micro-encapsulation, " U.S. Patent pending.
2. Jourdain, A., P. De Moor, S. Pamidighantam, and H. A. C. Tilmans. "Investigation of the Hermeticity of BCB-Sealed Cavities for Housing RF MEMS Devices," MEMS 2002 IEEE Intl. Conf., pp.677-80.
3. Margomenos, A. and L. Katehi, "Fabrication and Accelerated Hermeticity Testing of On-Wafer Package for RF MEMS," IEEE Trans. Microwave Theory Tech., vol. 52, no. 6., pp. 1626-1636, June 2004.
4. Forehand D.I., Goldsmith C.L, "Wafer Level micro Encapsulation", presented at the 2005 Government Microcircuit Applications Conference (GOMACTech 05), Las Vegas, NV, April 2005
5. Eyring, H., H. Lin, and S. Lin, Basic Chemical Kinetics. New York: Wiley, 1980.
6. Halliberg, D. and S. Peck, "Recent humidity accelerations, a base for testing standards," Qual. Reliab. Eng. Int., vol. 7, pp. 169-180, 1991.
7. Freund, J., J. Halbritter, and J. Horber, ''How Dry Are Samples? Water Adsorption Measured by STM," Microsc. Res. Tech., vol. 44. pp. 327-338, 1991.