Wafer-scale packaged RF-MEMS switches

IEEE MTT-S International Microwave Symposium Digest

Volumn , Issue , 2006, Pages 267-270

  Muldavin, J ^a   Bozler, C ^a   Keast, C ^a  

^a MIT LINCOLN LABORATORY   (United States)

Author keywords

Hermetic; High isolation; MEMS; Packaging; SP4T; Switch

Indexed keywords

BROAD-BAND PACKAGING TECHNOLOGY; HIGH ISOLATION; SERIES-SHUNT PACKAGED CAPACITIVE SWITCHES;

CHIP SCALE PACKAGES; ELECTRIC SWITCHES; FREQUENCY BANDS; GAIN MEASUREMENT; INSERTION LOSSES; SILICON WAFERS;

MEMS;

EID: 34250348760     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MWSYM.2006.249484     Document Type: Conference Paper

References (7)

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