-
1
-
-
0038107834
-
Total ionizing dose effects in MOS oxides and devices
-
Jun
-
T. R. Oldham and F. B. McLean, "Total ionizing dose effects in MOS oxides and devices," IEEE Trans. Nucl. Sci., vol. 50, no. 3, pp. 483-499, Jun. 2003.
-
(2003)
IEEE Trans. Nucl. Sci
, vol.50
, Issue.3
, pp. 483-499
-
-
Oldham, T.R.1
McLean, F.B.2
-
2
-
-
33144457628
-
Radiation-induced edge effects in deep submicron CMOS transistors
-
Dec
-
F. Faceio and G. Cervelli, "Radiation-induced edge effects in deep submicron CMOS transistors," IEEE Trans. Nucl. Sci., vol. 52, no. 6, pp. 2413-2420, Dec. 2005.
-
(2005)
IEEE Trans. Nucl. Sci
, vol.52
, Issue.6
, pp. 2413-2420
-
-
Faceio, F.1
Cervelli, G.2
-
3
-
-
0031357733
-
Ionizing radiation induced leakage current on ultra-thin gate oxides
-
Dec
-
A. Scarpa, A. Paccagnella, F. Montera, G. Ghibaudo, G. Pananakakis, G. Ghidini, and P. G. Fuochi, "Ionizing radiation induced leakage current on ultra-thin gate oxides," IEEE Trans. Nucl. Sci., vol. 44, no. 6, pp. 1818-1825, Dec. 1997.
-
(1997)
IEEE Trans. Nucl. Sci
, vol.44
, Issue.6
, pp. 1818-1825
-
-
Scarpa, A.1
Paccagnella, A.2
Montera, F.3
Ghibaudo, G.4
Pananakakis, G.5
Ghidini, G.6
Fuochi, P.G.7
-
4
-
-
0032306849
-
Radiation induced leakage current and stress induced leakage current in ultra-thin gate oxides
-
Dec
-
M. Ceschia, A. Paccagnella, A. Cester, A. Scarpa, and G. Ghidini, "Radiation induced leakage current and stress induced leakage current in ultra-thin gate oxides," IEEE Trans. Nucl. Sci., vol. 45. no. 6, pp. 2375-2382, Dec. 1998.
-
(1998)
IEEE Trans. Nucl. Sci
, vol.45
, Issue.6
, pp. 2375-2382
-
-
Ceschia, M.1
Paccagnella, A.2
Cester, A.3
Scarpa, A.4
Ghidini, G.5
-
5
-
-
11044233448
-
Drain current decrease in MOSFETs after heavy ion irradiation
-
Dec
-
A. Cester, S. Gerardin, A. Paccagnella, J. R. Schwank, G. Vizkelethy, A. Candelori, and G. Ghidini, "Drain current decrease in MOSFETs after heavy ion irradiation," IEEE Trans. Nucl. Sci., vol. 48, no. 6, pp. 3150-3157, Dec. 2004.
-
(2004)
IEEE Trans. Nucl. Sci
, vol.48
, Issue.6
, pp. 3150-3157
-
-
Cester, A.1
Gerardin, S.2
Paccagnella, A.3
Schwank, J.R.4
Vizkelethy, G.5
Candelori, A.6
Ghidini, G.7
-
6
-
-
0038383138
-
Accelerated wear-out of ultra-thin gate oxides after irradiation
-
June
-
A. Cester. S. Cimino, A. Paccagnella, G. Ghibaudo, G. Ghidini. and J. Wyss, "Accelerated wear-out of ultra-thin gate oxides after irradiation," IEEE Trans. Nucl. Sci., vol. 50, no. 3, pp. 729-734, June 2003.
-
(2003)
IEEE Trans. Nucl. Sci
, vol.50
, Issue.3
, pp. 729-734
-
-
Cester, A.1
Cimino, S.2
Paccagnella, A.3
Ghibaudo, G.4
Ghidini, G.5
Wyss, J.6
-
8
-
-
33748575889
-
Continuous MOSFET performance increase with device scaling: The role of strain and channel material innovations
-
Jul./Sep
-
D. A. Antoniadis, I. Aberg, C. Ní Chléirigh, O. M. Nayfeh, A. Khakifirooz, and J. L. Hoyt, "Continuous MOSFET performance increase with device scaling: The role of strain and channel material innovations," IBM J. Res. Dev., vol. 50, no. 4/5, pp. 373-376, Jul./Sep. 2006.
-
(2006)
IBM J. Res. Dev
, vol.50
, Issue.4-5
, pp. 373-376
-
-
Antoniadis, D.A.1
Aberg, I.2
Ní Chléirigh, C.3
Nayfeh, O.M.4
Khakifirooz, A.5
Hoyt, J.L.6
-
9
-
-
0038454484
-
Radiation Effects in SOI Technologies
-
Jun
-
J. R. Schwank, V. Ferlet-Cavrois, M. R. Shaneyfelt, P. Paillet, and P. E. Dodd, "Radiation Effects in SOI Technologies," IEEE Trans. Nucl. Sci., vol. 50, no. 3, pp. 522-538, Jun. 2003.
-
(2003)
IEEE Trans. Nucl. Sci
, vol.50
, Issue.3
, pp. 522-538
-
-
Schwank, J.R.1
Ferlet-Cavrois, V.2
Shaneyfelt, M.R.3
Paillet, P.4
Dodd, P.E.5
-
10
-
-
1642634153
-
Influence of total-dose radiation on the electrical characteristics of SOI MOSFETs
-
J. A. Felix, J. R. Schwank, C. R. Cirba, R. D. Schrimpf, M. R. Shaneyfelt, D. M. Fleetwood, and P. E. Dodd, "Influence of total-dose radiation on the electrical characteristics of SOI MOSFETs," Microelectron. Eng., vol. 72, pp. 332-341, 2004.
-
(2004)
Microelectron. Eng
, vol.72
, pp. 332-341
-
-
Felix, J.A.1
Schwank, J.R.2
Cirba, C.R.3
Schrimpf, R.D.4
Shaneyfelt, M.R.5
Fleetwood, D.M.6
Dodd, P.E.7
-
11
-
-
11044234166
-
Impact of 7.5-MeV proton irradiation on front-back gate coupling effect in ultra thin gate oxide FD-SOI n-MOSFETs
-
Dec
-
K. Hayama, K. Takakura, H. Ohyama, J. M. Rafi, A. Mercha, E. Simoen, C. Claeys, and M. Kokkoris, "Impact of 7.5-MeV proton irradiation on front-back gate coupling effect in ultra thin gate oxide FD-SOI n-MOSFETs," IEEE Trans. Nucl. Sci., vol. 51, no. 6, pp. 3795-3800, Dec. 2004.
-
(2004)
IEEE Trans. Nucl. Sci
, vol.51
, Issue.6
, pp. 3795-3800
-
-
Hayama, K.1
Takakura, K.2
Ohyama, H.3
Rafi, J.M.4
Mercha, A.5
Simoen, E.6
Claeys, C.7
Kokkoris, M.8
-
12
-
-
1442360750
-
Total ionizing dose damage in deep submicron partially depleted SOI MOSFETs induced by proton irradiation
-
Jun
-
E. Simoen, J. M. Rafi, A. Mercha, and C. Claeys, "Total ionizing dose damage in deep submicron partially depleted SOI MOSFETs induced by proton irradiation," Solid-State Electron., vol. 48, pp. 1045-1054, Jun. 2004.
-
(2004)
Solid-State Electron
, vol.48
, pp. 1045-1054
-
-
Simoen, E.1
Rafi, J.M.2
Mercha, A.3
Claeys, C.4
-
13
-
-
34249030682
-
Dose rate dependence of the back gate degradation in thin gate oxide PD-SOI MOSFETs by 2-MeV electron irradiation
-
K. Hayama, K. Takakura, M. Yoneoka, H. Ohyama, J. M. Rafi, A. Mercha, E. Simoen, and C. Claeys, "Dose rate dependence of the back gate degradation in thin gate oxide PD-SOI MOSFETs by 2-MeV electron irradiation, "Microelectron. Eng., vol. 84, pp. 2125-2128, 2007.
-
(2007)
Microelectron. Eng
, vol.84
, pp. 2125-2128
-
-
Hayama, K.1
Takakura, K.2
Yoneoka, M.3
Ohyama, H.4
Rafi, J.M.5
Mercha, A.6
Simoen, E.7
Claeys, C.8
-
14
-
-
84898831635
-
Comparison of the radiation behavior of 65 nm fully depleted silicon-on-insulator MOSFETs employing different tensile-strain-inducing techniques
-
Sep. 27-29
-
S. Put, E. Simoen, E. Augendre, C. Claeys, M. Van Uffelen, and P. Leroux, "Comparison of the radiation behavior of 65 nm fully depleted silicon-on-insulator MOSFETs employing different tensile-strain-inducing techniques," in Proc. RADECS, Sep. 27-29, 2006.
-
(2006)
Proc. RADECS
-
-
Put, S.1
Simoen, E.2
Augendre, E.3
Claeys, C.4
Van Uffelen, M.5
Leroux, P.6
-
15
-
-
33144490099
-
Electrical stresses on ultra-thin gate oxide SOI MOSFETs after irradiation
-
Dec
-
A. Cester, S. Gerardin, A. Paccagnella, E. Simoen, and C. Claeys, "Electrical stresses on ultra-thin gate oxide SOI MOSFETs after irradiation," IEEE Trans. Nucl. Sci., vol. 52, no. 6, pp. 2252-2258, Dec. 2005.
-
(2005)
IEEE Trans. Nucl. Sci
, vol.52
, Issue.6
, pp. 2252-2258
-
-
Cester, A.1
Gerardin, S.2
Paccagnella, A.3
Simoen, E.4
Claeys, C.5
-
16
-
-
33751401551
-
On the scalability of source/drain current enhancement in thin film sSOI
-
E. Augendre, G. Eneman, A. De Keersgieter, V. Simons, I. De Wolf, J. Ramos, S. Brus, B. Pawlak, S. Severi, F. Leys, E. Sleeckx, S. Locorotondo, M. Ercken, J.-F. de Marneffe, L. Fei, M. Seacrist, B. Kellerman, M. Goodwin, K. De Meyer, M. Jurczak, and S. Biesemans, "On the scalability of source/drain current enhancement in thin film sSOI," in Proc. IEEE ESSDERC, 2005, pp. 301-304.
-
(2005)
Proc. IEEE ESSDERC
, pp. 301-304
-
-
Augendre, E.1
Eneman, G.2
De Keersgieter, A.3
Simons, V.4
De Wolf, I.5
Ramos, J.6
Brus, S.7
Pawlak, B.8
Severi, S.9
Leys, F.10
Sleeckx, E.11
Locorotondo, S.12
Ercken, M.13
de Marneffe, J.-F.14
Fei, L.15
Seacrist, M.16
Kellerman, B.17
Goodwin, M.18
De Meyer, K.19
Jurczak, M.20
Biesemans, S.21
more..
-
17
-
-
2342563124
-
Strained Si, SiGe, and Ge on-insulator: Review of wafer bonding fabrication techniques
-
Aug
-
G. Taraschi, A. J. Pitera, and E. A. Fitzgerald, "Strained Si, SiGe, and Ge on-insulator: Review of wafer bonding fabrication techniques," Solid-State Electron., vol. 48, no. 8, pp. 1297-1305, Aug. 2004.
-
(2004)
Solid-State Electron
, vol.48
, Issue.8
, pp. 1297-1305
-
-
Taraschi, G.1
Pitera, A.J.2
Fitzgerald, E.A.3
-
18
-
-
0035925937
-
SIRAD: An irradiation facility at the LNL tandem accelerator for radiation damage studies on semiconductor detectors and electronics devices and systems
-
J. Wyss, D. Bisello, and D. Pantano, "SIRAD: An irradiation facility at the LNL tandem accelerator for radiation damage studies on semiconductor detectors and electronics devices and systems," Nucl. Instrum. Meth. Phys. Res. A, vol. 462, pp. 426-434, 2001.
-
(2001)
Nucl. Instrum. Meth. Phys. Res. A
, vol.462
, pp. 426-434
-
-
Wyss, J.1
Bisello, D.2
Pantano, D.3
-
19
-
-
33144470739
-
Radiation-induced breakdown in 1.7 nm oxyniteided gate oxides
-
Dec
-
S. Gerardin. A. Cester, A. Paccagnella, G. Gasiot. P. Mazoyer, and P. Roche, "Radiation-induced breakdown in 1.7 nm oxyniteided gate oxides," IEEE Trans. Nucl. Sci., vol. 52, no. 6, pp. 2210-2216, Dec. 2005.
-
(2005)
IEEE Trans. Nucl. Sci
, vol.52
, Issue.6
, pp. 2210-2216
-
-
Gerardin, S.1
Cester, A.2
Paccagnella, A.3
Gasiot, G.4
Mazoyer, P.5
Roche, P.6
-
20
-
-
0034205654
-
Low field leakage current and soft breakdown in ultra-thin gate oxides after heavy ions, electrons or X-ray irradiation
-
June
-
M. Ceschia, A. Paccagnella, S. Sandrin, G. Ghidini, J. Wyss, M. Lavalle, and O. Flament, "Low field leakage current and soft breakdown in ultra-thin gate oxides after heavy ions, electrons or X-ray irradiation." IEEE Trans. Nucl. Sci., vol. 47, pp. 566-573, June 2000.
-
(2000)
IEEE Trans. Nucl. Sci
, vol.47
, pp. 566-573
-
-
Ceschia, M.1
Paccagnella, A.2
Sandrin, S.3
Ghidini, G.4
Wyss, J.5
Lavalle, M.6
Flament, O.7
-
21
-
-
0027875525
-
Total dose failures in advanced electronics from single ions
-
T. R. Oldham, K. W. Bennett, J. Beaucour, T. Carriere, C. Poivey, and P. Garnier, "Total dose failures in advanced electronics from single ions," IEEE Trans. Nucl. Sci., vol. 40, no. 6, pp. 1820-1830, 1993.
-
(1993)
IEEE Trans. Nucl. Sci
, vol.40
, Issue.6
, pp. 1820-1830
-
-
Oldham, T.R.1
Bennett, K.W.2
Beaucour, J.3
Carriere, T.4
Poivey, C.5
Garnier, P.6
-
22
-
-
0036508455
-
Reliability limits for the gate insulator in CMOS technology
-
J. H. Stathis, "Reliability limits for the gate insulator in CMOS technology," IBM J. Res. Dev., vol. 46, pp. 265-286, 2002.
-
(2002)
IBM J. Res. Dev
, vol.46
, pp. 265-286
-
-
Stathis, J.H.1
-
23
-
-
0036089047
-
A thorough investigation of progressive breakdown in ultra-thin oxides. Physical understanding and application for industrial reliability assessment
-
F. Monsieur, E. Vincent, D. Roy, S. Bruyere, J. C. Vildeuil, G. Pananakakis, and G. Ghibaudo, "A thorough investigation of progressive breakdown in ultra-thin oxides. Physical understanding and application for industrial reliability assessment," in Proc. 40th. IRPS, 2002, pp. 45-54.
-
(2002)
Proc. 40th. IRPS
, pp. 45-54
-
-
Monsieur, F.1
Vincent, E.2
Roy, D.3
Bruyere, S.4
Vildeuil, J.C.5
Pananakakis, G.6
Ghibaudo, G.7
-
24
-
-
0029379446
-
Opposite-channel-based charge injection in SOI MOSFET's under hot carrier stress
-
Sept
-
A. Zaleski, S. P. Sinha, D. E. Ioannou, G. J. Campisi, and H. L. Hughes, "Opposite-channel-based charge injection in SOI MOSFET's under hot carrier stress," IEEE Trans. Elec. Dev., vol. 42, no. 9, pp. 1697-1700, Sept. 1995.
-
(1995)
IEEE Trans. Elec. Dev
, vol.42
, Issue.9
, pp. 1697-1700
-
-
Zaleski, A.1
Sinha, S.P.2
Ioannou, D.E.3
Campisi, G.J.4
Hughes, H.L.5
-
25
-
-
22544445284
-
Scaling limits and reliability of SOI CMOS technology
-
D. E. Ioannou, "Scaling limits and reliability of SOI CMOS technology," in J. Phys.: Conf. Ser., 2005, vol. 10, pp. 1-6.
-
(2005)
J. Phys.: Conf. Ser
, vol.10
, pp. 1-6
-
-
Ioannou, D.E.1
-
26
-
-
34547268597
-
Experimental evidence of short-channel electron mobility degradation caused by interface charges located at the gate-edge of triple-gate FinFETs
-
Oct
-
J. Ramos, E. Augendre, A. Kottantharayil, A. Mercha, E. Simoen, M. Rosmeulen, S. Severi, C. Kerner, T. Chiarella, A. Nackaerts, I. Ferain, T. Hoffmann, M. Jurczak, and S. Biesemans, "Experimental evidence of short-channel electron mobility degradation caused by interface charges located at the gate-edge of triple-gate FinFETs," in Proc. Int. Conf. Solid-State Integrated Circuit Technol., Oct. 2006, pp. 72-74.
-
(2006)
Proc. Int. Conf. Solid-State Integrated Circuit Technol
, pp. 72-74
-
-
Ramos, J.1
Augendre, E.2
Kottantharayil, A.3
Mercha, A.4
Simoen, E.5
Rosmeulen, M.6
Severi, S.7
Kerner, C.8
Chiarella, T.9
Nackaerts, A.10
Ferain, I.11
Hoffmann, T.12
Jurczak, M.13
Biesemans, S.14
-
27
-
-
37249093083
-
Impact of HfSiON induced flicker noise on scaling of future mixed-signal CMOS
-
Jun. 13-17
-
Y. Yasuda, C.-H. Lin, T.-J. K. Liu, and C. Hu, "Impact of HfSiON induced flicker noise on scaling of future mixed-signal CMOS," in Proc. Symp. VLSI Technol., Jun. 13-17, 2006, pp. 106-107.
-
(2006)
Proc. Symp. VLSI Technol
, pp. 106-107
-
-
Yasuda, Y.1
Lin, C.-H.2
Liu, T.-J.K.3
Hu, C.4
-
28
-
-
47249114376
-
-
A. Shickova, N. Collaert, P. Zimmerman, M. Demand, E. Simoen, G. Pourtois, A. De Keersgieter, L. Trojman, 1. Ferain, F. Leys, W. Boullart, A. Franquet, B. Kaczer, M. Jurczak, H. Maes, and G. Groeseneken, Novel, effective and cost-efficient method of introducing fluorine into metal/Hf-based gate stack in MuGFET and planar SOI devices with significant BTI improvement, in Proc. Symp. VLSI Technol., Jun. 12-16, 2007, pp. 112-113.
-
A. Shickova, N. Collaert, P. Zimmerman, M. Demand, E. Simoen, G. Pourtois, A. De Keersgieter, L. Trojman, 1. Ferain, F. Leys, W. Boullart, A. Franquet, B. Kaczer, M. Jurczak, H. Maes, and G. Groeseneken, "Novel, effective and cost-efficient method of introducing fluorine into metal/Hf-based gate stack in MuGFET and planar SOI devices with significant BTI improvement," in Proc. Symp. VLSI Technol., Jun. 12-16, 2007, pp. 112-113.
-
-
-
-
29
-
-
31544445524
-
A reliable and manufacturable method to induce a stress of >1 GPa on a P-channel MOSFET in high volume manufacturing
-
Feb
-
R. Arghavani, L. Xia, H. M'Saad, M. Balseanu, G. Karunasiri, A. Mascarenhas, and S. E. Thompson, "A reliable and manufacturable method to induce a stress of >1 GPa on a P-channel MOSFET in high volume manufacturing," IEEE Electron. Dev. Lett., vol. 27, no. 2, pp. 114-116, Feb. 2006.
-
(2006)
IEEE Electron. Dev. Lett
, vol.27
, Issue.2
, pp. 114-116
-
-
Arghavani, R.1
Xia, L.2
M'Saad, H.3
Balseanu, M.4
Karunasiri, G.5
Mascarenhas, A.6
Thompson, S.E.7
-
30
-
-
14644389452
-
Optimization of low temperature silicon nitride processes for improvement of device performance
-
E. Sleeckx, M. Schaekers, X. Shi, E. Kunnen, B. Degroote, M. Jurczak, M. Broeck, and E. de Potter de ten Augendre, "Optimization of low temperature silicon nitride processes for improvement of device performance," Microelectron. Reliabil. vol. 45, pp. 865-868, 2005.
-
(2005)
Microelectron. Reliabil
, vol.45
, pp. 865-868
-
-
Sleeckx, E.1
Schaekers, M.2
Shi, X.3
Kunnen, E.4
Degroote, B.5
Jurczak, M.6
Broeck, M.7
de Potter de ten Augendre, E.8
|