Mechanical tensile fracture behaviors of solid-state-annealed eutectic SnPb and lead-free solder flip chip bumps

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2003, Pages 680-684

  Jang, Jin Wook ^a   De Silva, Ananda ^a   Lin, Jong Kai ^a   Frear, Darrel ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; BRITTLE FRACTURE; EMBRITTLEMENT; EUTECTICS; INTEGRATED CIRCUIT MANUFACTURE; INTERFACES (MATERIALS); MICROSTRUCTURE; SILVER; SOLDERING ALLOYS; TEMPERATURE; TIN ALLOYS;

BRITTLE INTERFACIAL FRACTURE; LEAD FREE SOLDER FLIP CHIP BUMPS; MECHANICAL TENSILE FRACTURE; SOLID STATE ANNEALING;

FLIP CHIP DEVICES;

EID: 0037674773     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (14)

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