Environmental aspects of microelectronics

Advances in Electronic Packaging

Volumn 3, Issue , 2001, Pages 1575-1581

  Muller, Jutta ^a   Griese, H ^a   Zuber, K H ^a   Reichl, H ^b   Schischke, K ^b  

^a FRAUNHOFER IZM   (Germany)

^b TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ECONOMIC AND SOCIAL EFFECTS; ENERGY UTILIZATION; ENVIRONMENTAL IMPACT; INTEGRATED CIRCUITS; LEAD; LIFE CYCLE; RAW MATERIALS; TOXIC MATERIALS;

ELECTRONIC INTERCONNECTION; HALOGEN FREE PLASTICS;

MICROELECTRONICS;

EID: 0346308237     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

1. Commission of the European communities: Proposal JOT a Directive of the European Parliament on Waste Electrical and Electronic Equipment; Proposal for a Directive of the European Parliament on the restriction of the use of certain hazardous substances in electrical and electronic equipment. Brussels, 9.6.2000
2. Graedel, T. E.; Allenby, B. R.: Industrial Ecology. Prentice Hall, Englewood Cliffs, USA 1995
3. Middendorf, A.; Nissen, N. F.; Griese, H.; Müller, J.; Pötter, H.; Reichl, H.; Stobbe, I.: EE-Toolbox - A modular assessment system for the environmental optimization of electronics. Conf. Record 2000 IEEE Int. Symp. on Electronics and the Environment, San Francisco/CA, May 8-10, 2000
4. Nissen, N. F.: Entwicklung eines ökologischen Bewertungsmodells zur Beurteilung elektronischer Systeme. Dissertation zur Erlangung des akademischen Grades Doktor der Ingenieurwissenschaften am Fachbereich 12 - Elektrotechnik der Technischen Universität Berlin (Doctoral Thesis), 2001
5. Pfahl, R. C.: Green Electronics: Trends in the US. Joint Int. Congr. EGG2000+, VDE Verlag Berlin, Offenbach, September 11-13, 2000
6. Suga, T: Trend of Lead-free Soldering in Japan - a Report from NEDO Project 1999-2000. Joint Int. Congr. EGG2000+, VDE Verlag Berlin, Offenbach, September 11 - 13, 2000
7. Griese, H; Müller, J.; Reichl, H.; Somi, G.; Stevels, A.; Zuber, K. H.: Environmental Assessment of Lead Free Interconnection Systems. Proc. Symp. on Lead Free Interconnect Technology, SMTA, Boston/Massachusetts, June 13 -14, 2000
8. Ernest Merian (Ed.): "Metals and Their Compounds in the Environment". VCH Verlagsgesellschaft mbH, Weinheim (FRG), 1991
9. W. B. Blackburn, L. R. Newcomer, T. A. Kimmell: "Performance of the Toxicity Characteristic Leaching Procedure". Wilson Laboratories, S-Cubed, U. S. EPA
10. Schischke, K.; Stutz, M., Ruelle, J.-P.; Griese, H.; Reichl, H.: Life Cycle Inventory Analysis and Identification of Environmentally Significant Aspects in Semiconductor Manufacturing. Conference Proceedings 2001 IEEE/ISEE, Denver, U.S.A.
11. th Discussion Forum on Life Cycle Assessment, April 2001, Lausanne, Switzerland