Correlation between chemical reaction and brittle fracture found in electroless Ni(P)/immersion gold-solder interconnection

Journal of Materials Research

Volumn 20, Issue 8, 2005, Pages 1931-1934

  Sohn, Yoon Chul ^a   Yu, Jin ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

BRITTLE FRACTURE; CHEMICAL REACTIONS; CRYSTAL GROWTH; CRYSTAL MICROSTRUCTURE; CRYSTALLIZATION; DEGRADATION; GOLD; INTERMETALLICS; NICKEL COMPOUNDS; SOLDERED JOINTS; SPALLING; TERNARY SYSTEMS;

BRITTLE INTERFACIAL FRACTURE; MICROSTRUCTURE DEGRADATION;

ELECTROLESS PLATING;

EID: 28844456147     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.2005.0246     Document Type: Article

References (24)

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