Effect of cooling rate on growth of the intermetallic compound and fracture mode of near-eutectic Sn-Ag-Cu/Cu Pad: Before and after aging

Journal of Electronic Materials

Volumn 33, Issue 12, 2004, Pages 1530-1544

  Jeong, Sang Won ^a   Kim, Jong Hoon ^a   Lee, Hyuck M O ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

Aging; Cooling rate; Fracture mode; Intermetallic compound (IMC) thickness; Near eutectic Sn Ag Cu solder; Shear strength

Indexed keywords

AGING OF MATERIALS; COOLING; DUCTILITY; FRACTURE MECHANICS; MELTING; SHEAR STRENGTH; SILVER; TIN;

COOLING RATE; FRACTURE MODE; INTERMETALLIC COMPOUND (IMC) THICKNESS; NEAR-EUTECTIC SN-AG-CU SOLDERS;

INTERMETALLICS;

EID: 11344284631     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-004-0095-9     Document Type: Conference Paper

References (16)

1. F.W. Gayle et al., JOM 53 (6), 17 (2001).
2. W.K. Choi, J.H. Kim, S.W. Jeong, and H.M. Lee, J. Mater. Res. 17, 43 (2002).
3. D.R. Frear, J.W. Jang, J.K. Lin, and C. Zhang, JOM 53 (6), 28 (2001).
4. K. Zeng and K.N. Tu, Mater. Sci. Eng. R 38, 55 (2002).
5. K.-W. Moon, W.J. Boettinger, U.R. Kattner, F.S. Biancaniello, and C.A. Handwerker, J. Electron. Mater. 29, 1122 (2000).
6. S.K. Kang, W.K. Choi, D.-Y. Shih, D.W. Henderson, T. Gosselin, A. Sarkhel, C. Goldsmith, and K.J. Puttlitz, Proc. of Electronic Components and Technology Conf. (Piscataway, NJ: IEEE, 2003), pp. 64-70.
7. J.-Y. Park, C.-U. Kim, T. Carper, and V. Puligandla, J. Electron. Mater. 32, 1297 (2003).
8. W.K. Choi and H.M. Lee, J. Electron. Mater. 29, 1207 (2000).
9. C.-W. Hwang, K.-S. Kim, and K. Suganuma, J. Electron. Mater. 32, 1249 (2003).
10. J.H. Lau, Solder Joint Reliability (New York: Van Nostrand Reinhold, 1991), p. 406.
11. B.-S. Chiou and J.-C. Cheng, J. Mater. Sci. 5, 229 (1994).
12. F. Ochoa, J.J. Williams, and N. Chawla, J. Electron. Mater. 32, 1414 (2003).
13. X. Deng, G. Piotrowski, J.J. Williams, and N. Chawla, J. Electron. Mater. 32, 1403 (2003).
14. K. Noguchi, M. Ikeda, I. Shimizu, Y. Kawamura, and Y. Ohno, Mater. Trans. 42, 761 (2001).
15. M.O. Alam, Y.C. Chen, and K.N. Tu, J. Appl. Phys. 94, 7904 (2003).
16. S.F. Dirnfeld and J.J. Ramon, Welding J., Res. Suppl. 69, 373-s (1990).