Investigation of the Interfacial Reaction between Sn-Zn-Bi Lead-Free Solder and Cu Electrode

journal of the japan institute of electronics packaging

Volumn 7, Issue 1, 2004, Pages 47-53

  Yanagawa, Hiroto ^a   Imamura, Takeshi ^b   Ide, Eiichi ^c   Hirose, Akio ^c   Kobayashi, Kojiro F ^c  

^a PANASONIC CORPORATION   (Japan)

^b FUJITSU LABORATORIES LTD   (Japan)

^c OSAKA UNIVERSITY   (Japan)

Author keywords

Activation Energy; Cu5Zn8; Growth Kinetics of Reaction Layer; Interfacial Reaction; Sn 8Zn 3Bi Solder

Indexed keywords

EID: 85009548495     PISSN: 13439677     EISSN: 1884121x     Source Type: Journal    
DOI: 10.5104/jiep.7.47     Document Type: Article

References (1)

1. Proc. 7th Symposium on Microjoining and Assembly Technologies for Electronics, Yokohama Japan, pp. 277-282, 2002.