-
2
-
-
22144494719
-
Advanced etching of silicon based on deep reactive ion etching for silicon high aspect ratio microstructures and three-dimensional micro- and nanostructures
-
10.1016/j.mejo.2005.04.039 0026-2692
-
Marty F, Rousseau L, Saadany B, Mercier B, Francais O, Mita Y and Bourouina T 2005 Advanced etching of silicon based on deep reactive ion etching for silicon high aspect ratio microstructures and three-dimensional micro- and nanostructures Microelectron. J. 36 673-7
-
(2005)
Microelectron. J.
, vol.36
, Issue.7
, pp. 673-677
-
-
Marty, F.1
Rousseau, L.2
Saadany, B.3
Mercier, B.4
Francais, O.5
Mita, Y.6
Bourouina, T.7
-
3
-
-
31444438671
-
Optical characteristics of one-dimensional photonic crystals composed of high-aspect-ratio Si walls fabricated on V-grooved wafer
-
10.1016/j.photonics.2005.11.005 1569-4410
-
Hosomi K, Fukamachi T, Yamada H, Katsuyama T and Arakawa Y 2006 Optical characteristics of one-dimensional photonic crystals composed of high-aspect-ratio Si walls fabricated on V-grooved wafer Photon. Nanostruct. Fundam. Appl. 4 30-4
-
(2006)
Photon. Nanostruct. Fundam. Appl.
, vol.4
, Issue.1
, pp. 30-34
-
-
Hosomi, K.1
Fukamachi, T.2
Yamada, H.3
Katsuyama, T.4
Arakawa, Y.5
-
4
-
-
14944384787
-
Microfabricated textured surfaces for super-hydrophobicity investigations
-
10.1016/j.mee.2004.12.093 0167-9317
-
Callies M, Chen Y, Marty F, Pépin A and Quéré D 2005 Microfabricated textured surfaces for super-hydrophobicity investigations Microelectron. Eng. 78-79 100-5
-
(2005)
Microelectron. Eng.
, vol.78-79
, pp. 100-105
-
-
Callies, M.1
Chen, Y.2
Marty, F.3
Pépin, A.4
Quéré, D.5
-
5
-
-
0031072583
-
RIE lag in high aspect ratio trench etching of silicon
-
10.1016/S0167-9317(96)00142-6 0167-9317
-
Jansen H, de Boer M, Wiegerink R, Tas N, Smulders E, Neagu C and Elwenspoek M 1997 RIE lag in high aspect ratio trench etching of silicon Microelectron. Eng. 35 45-50
-
(1997)
Microelectron. Eng.
, vol.35
, Issue.1-4
, pp. 45-50
-
-
Jansen, H.1
De Boer, M.2
Wiegerink, R.3
Tas, N.4
Smulders, E.5
Neagu, C.6
Elwenspoek, M.7
-
6
-
-
0032753082
-
Characterization of a time multiplexed inductively coupled plasma etcher
-
10.1149/1.1391611 0013-4651
-
Ayn A A, Braff R, Lin C C, Sawin H H and Schmidt M A 1999 Characterization of a time multiplexed inductively coupled plasma etcher J. Electrochem. Soc. 146 339-149
-
(1999)
J. Electrochem. Soc.
, vol.146
, Issue.1
, pp. 339-149
-
-
Ayn, A.A.1
Braff, R.2
Lin, C.C.3
Sawin, H.H.4
Schmidt, M.A.5
-
7
-
-
0030100650
-
Silicon fusion bonding and deep reactive ion etching; A new technology for microstructures
-
10.1016/0924-4247(96)80138-5 0924-4247 A
-
Klaassen E, Petersen K, Noworolski J, Logan J, Maluf N, Brown J, Storment C, McCulley W and Kovacs G 1996 Silicon fusion bonding and deep reactive ion etching; a new technology for microstructures Sensors Actuators A 52 132-9
-
(1996)
Sensors Actuators
, vol.52
, Issue.1-3
, pp. 132-139
-
-
Klaassen, E.1
Petersen, K.2
Noworolski, J.3
Logan, J.4
Maluf, N.5
Brown, J.6
Storment, C.7
McCulley, W.8
Kovacs, G.9
-
9
-
-
14844289041
-
MEMSNAS: Microloading effect for micromachining 3D structures with nearly arbitrary shapes: Application to micro-optics on silicon
-
Bourouina T, Masuzawa T and Fujita H 2001 MEMSNAS: Microloading effect for micromachining 3D structures with nearly arbitrary shapes: application to micro-optics on silicon IEEE/LEOS Optical MEMS Conf., (August 2001) pp 81-2
-
(2001)
IEEE/LEOS Optical MEMS Conf., (August 2001)
, pp. 81-82
-
-
Bourouina, T.1
Masuzawa, T.2
Fujita, H.3
-
10
-
-
1942468589
-
The MEMSNAS process: Microloading effect for micromachining 3D structures of nearly all shapes
-
10.1109/JMEMS.2003.823219 1057-7157
-
Bourouina T, Masuzawa T and Fujita H 2004 The MEMSNAS process: microloading effect for micromachining 3D structures of nearly all shapes J. Microelectromech. Syst. 13 190-9
-
(2004)
J. Microelectromech. Syst.
, vol.13
, Issue.2
, pp. 190-199
-
-
Bourouina, T.1
Masuzawa, T.2
Fujita, H.3
-
12
-
-
0036734075
-
A boron etch-stop assisted lateral silicon etching process for improved high-aspect-ratio silicon micromachining and its applications
-
0960-1317 310
-
Hsieh J and Fang W 2002 A boron etch-stop assisted lateral silicon etching process for improved high-aspect-ratio silicon micromachining and its applications J. Micromech. Microeng. 12 574-81
-
(2002)
J. Micromech. Microeng.
, vol.12
, Issue.5
, pp. 574-581
-
-
Hsieh, J.1
Fang, W.2
-
13
-
-
0036853462
-
A bulk microfabricated multi-axis capacitive cellular force sensor using transverse comb drives
-
0960-1317 314
-
Nilsson D, Jensen S and Menon A 2002 A bulk microfabricated multi-axis capacitive cellular force sensor using transverse comb drives J. Micromech. Microeng. 12 832-40
-
(2002)
J. Micromech. Microeng.
, vol.12
, Issue.6
, pp. 832-840
-
-
Nilsson, D.1
Jensen, S.2
Menon, A.3
-
14
-
-
3142773273
-
Development of the one-step DRIE dry process for unconstrained fabrication of released MEMS devices
-
0960-1317 014
-
Docker P T, Kinnell P K and Ward M C L 2004 Development of the one-step DRIE dry process for unconstrained fabrication of released MEMS devices J. Micromech. Microeng. 14 941-4
-
(2004)
J. Micromech. Microeng.
, vol.14
, Issue.7
, pp. 941-944
-
-
Docker, P.T.1
Kinnell, P.K.2
Ward, M.C.L.3
-
15
-
-
27544499336
-
A contour-lithography method for rapid and precise deep-etched nano-MEMS structure fabrication
-
Kubota M, Mita Y, Ito K, Marty F, Bourouina T and Shibata T 2005 A contour-lithography method for rapid and precise deep-etched nano-MEMS structure fabrication Int. Conf. on Solid-State Sensors, Actuators and Microsystems (Transducers '05) vol 2 pp 1449-52
-
(2005)
Int. Conf. on Solid-State Sensors, Actuators and Microsystems (Transducers '05)
, vol.2
, pp. 1449-1452
-
-
Kubota, M.1
Mita, Y.2
Ito, K.3
Marty, F.4
Bourouina, T.5
Shibata, T.6
-
19
-
-
0038451889
-
Microelectromechanical systems and system-on-chip connectivity
-
10.1109/MCAS.2002.1045855 1531-636X
-
Chowdhury S, Ahmadi M and Miller W C 2002 Microelectromechanical systems and system-on-chip connectivity IEEE Circuits Syst. Mag. 2 2028-44
-
(2002)
IEEE Circuits Syst. Mag.
, vol.2
, Issue.2
, pp. 4-2044
-
-
Chowdhury, S.1
Ahmadi, M.2
Miller, W.C.3
-
20
-
-
18544391592
-
A novel electrostatic vertical actuator fabricated in one homogeneous silicon wafer using extended SBM technology
-
10.1016/S0924-4247(01)00846-9 0924-4247 A
-
Kim J, Park S and Cho D 2002 A novel electrostatic vertical actuator fabricated in one homogeneous silicon wafer using extended SBM technology Sensors Actuators A 97-98 653-8
-
(2002)
Sensors Actuators
, vol.97-98
, Issue.3
, pp. 653-658
-
-
Kim, J.1
Park, S.2
Cho, D.3
-
21
-
-
1542604570
-
Multilevel beam SOI-MEMS fabrication and applications
-
10.1109/JMEMS.2003.823226 1057-7157
-
Milanovic V 2004 Multilevel beam SOI-MEMS fabrication and applications J. Microelectromech. Syst. 13 19-30
-
(2004)
J. Microelectromech. Syst.
, vol.13
, Issue.1
, pp. 19-30
-
-
Milanovic, V.1
-
22
-
-
4243182631
-
A self-aligned vertical comb-drive actuator on an SOI wafer for a 2D scanning micromirror
-
0960-1317 005
-
Hah D, Choi C A, Kim C K and Jun C H 2004 A self-aligned vertical comb-drive actuator on an SOI wafer for a 2D scanning micromirror J. Micromech. Microeng. 14 1148-56
-
(2004)
J. Micromech. Microeng.
, vol.14
, Issue.8
, pp. 1148-1156
-
-
Hah, D.1
Choi, C.A.2
Kim, C.K.3
Jun, C.H.4
-
24
-
-
0030720578
-
Controlled pulse-etching with xenon difluoride'
-
Chu P B, Chen J T, Yeh R, Lin G, Huang J C P, Warneke B A and Pister S J Controlled pulse-etching with xenon difluoride' Int. Conf. on Solid State Sensors and Actuators (Transducers '97) vol 1 pp 665-8
-
Int. Conf. on Solid State Sensors and Actuators (Transducers '97)
, vol.1
, pp. 665-668
-
-
Chu, P.B.1
Chen, J.T.2
Yeh, R.3
Lin, G.4
Huang, J.C.P.5
Warneke, B.A.6
Pister, S.J.7
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