A boron etch-stop assisted lateral silicon etching process for improved high-aspect-ratio silicon micromachining and its applications

Journal of Micromechanics and Microengineering

Volumn 12, Issue 5, 2002, Pages 574-581

  Hsieh, Jerwei ^a   Fang, Weileun ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BORON; CONSTRAINT THEORY; ETCHING; GYROSCOPES; MICROELECTROMECHANICAL DEVICES; MICROELECTRONIC PROCESSING; RESONATORS; SILICON WAFERS;

DUAL MASS SPRING RESONATOR; HIGH ASPECT RATIO SILICON MICROMACHINING; MICROVIBRATING GYROSCOPE; SILICON ETCHING PROCESS; SURFACE MICROMACHINING;

MICROMACHINING;

EID: 0036734075     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/12/5/310     Document Type: Article

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