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Volumn 2, Issue 2, 2002, Pages 4-28

Microelectromechanical systems and system-on-chip connectivity

Author keywords

[No Author keywords available]

Indexed keywords

CMOS INTEGRATED CIRCUITS; ELECTRIC CONNECTORS; ELECTRONICS PACKAGING; SENSORS;

EID: 0038451889     PISSN: 1531636X     EISSN: None     Source Type: Journal    
DOI: 10.1109/MCAS.2002.1045855     Document Type: Article
Times cited : (6)

References (27)
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    • (2000) Vision Statement
    • Tang, W.C.1
  • 2
    • 0002691121 scopus 로고    scopus 로고
    • A primer on a dual microphone directional system
    • January
    • Brian Csermak, "A Primer on a Dual Microphone Directional System", The Hearing Review, vol. 7, no. 1, pp. 56-58, January 2000.
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    • Csermak, B.1
  • 4
    • 0027236522 scopus 로고
    • Development of a directional hearing instrument based on array technology
    • W. Soede, J. B. Augustinus, and F. A. Bilsen, "Development of a Directional Hearing Instrument Based on Array Technology", Journal of the Acoustical Society of America, vol. 94, no. 2, pp. 785-795, 1993.
    • (1993) Journal of the Acoustical Society of America , vol.94 , Issue.2 , pp. 785-795
    • Soede, W.1    Augustinus, J.B.2    Bilsen, F.A.3
  • 5
    • 0009589138 scopus 로고    scopus 로고
    • A microphone array for hearing aids
    • Second Quarter
    • Bernard Widrow, "A Microphone Array for Hearing Aids", Circuits and Systems, vol. 1, no. 2, pp. 26-32, Second Quarter 2001.
    • (2001) Circuits and Systems , vol.1 , Issue.2 , pp. 26-32
    • Widrow, B.1
  • 6
    • 0029764930 scopus 로고    scopus 로고
    • Simulations of multi-microphone hearing aids in multiple interference environment
    • M. W. Huffman and R. W. Stewart, "Simulations of Multi-Microphone Hearing Aids in Multiple Interference Environment", British Journal of Audiology, vol. 30, pp. 249-260, 1996.
    • (1996) British Journal of Audiology , vol.30 , pp. 249-260
    • Huffman, M.W.1    Stewart, R.W.2
  • 9
    • 3242872881 scopus 로고
    • Arrays with constant beamwidth over a wide frequency-range
    • D. G. Tucker, "Arrays with Constant BeamWidth over a Wide Frequency-Range", Nature, vol. 180, pp. 496-497, 1957.
    • (1957) Nature , vol.180 , pp. 496-497
    • Tucker, D.G.1
  • 10
    • 33748500289 scopus 로고
    • Broad-band constant beam-width transducers
    • J. C. Morris, "Broad-Band Constant Beam-Width Transducers", Journal of Sound and Vibration, vol. 1, pp. 28-40, 1964.
    • (1964) Journal of Sound and Vibration , vol.1 , pp. 28-40
    • Morris, J.C.1
  • 13
    • 0032289625 scopus 로고    scopus 로고
    • High-performance condenser microphone with fully integrated CMOS amplifier and DC-DC voltage converter
    • December
    • M. Pederson, W. Olthuis, and P. Bergveld, "High-Performance Condenser Microphone with Fully Integrated CMOS Amplifier and DC-DC Voltage Converter", Journal of Microelectromechanical Systems, vol. 7., no. 4, pp. 387-394, December 1998.
    • (1998) Journal of Microelectromechanical Systems , vol.7 , Issue.4 , pp. 387-394
    • Pederson, M.1    Olthuis, W.2    Bergveld, P.3
  • 15
    • 0032300714 scopus 로고    scopus 로고
    • Structural and mechanical properties of polycrystalline silicon germanium for micromachining applications
    • December
    • S. Sedky, P. Fiorini, M. Caymax, S. Loreti, K. Baert, L. Hermans, and R. Mertens, "Structural and Mechanical Properties of Polycrystalline Silicon Germanium for Micromachining Applications", Journal of Microelectromechanical Systems, vol. 7, no. 4, pp. 365-372, December 1998.
    • (1998) Journal of Microelectromechanical Systems , vol.7 , Issue.4 , pp. 365-372
    • Sedky, S.1    Fiorini, P.2    Caymax, M.3    Loreti, S.4    Baert, K.5    Hermans, L.6    Mertens, R.7
  • 17
    • 0037775146 scopus 로고    scopus 로고
    • IntelliSense Corporation. (modified), [Online]
    • IntelliSense Corporation. (1999), Software for MEMS (modified), [Online]; Available: http://www.intellisense.com/software.htm
    • (1999) Software for MEMS
  • 18
    • 0033724566 scopus 로고    scopus 로고
    • Microrelay packaging technology using flip-chip assembly
    • Miyajaki, Japan
    • David C. Miller, Wenge Zhang, and Victor M. Bright, "Microrelay Packaging Technology Using Flip-Chip Assembly", Proceedings of MEMS 2000, Miyajaki, Japan, pp. 265-270, 2000.
    • (2000) Proceedings of MEMS 2000 , pp. 265-270
    • Miller, D.C.1    Zhang, W.2    Bright, V.M.3
  • 19
    • 0035437353 scopus 로고    scopus 로고
    • Packages go vertical
    • August
    • H. GoldStein, "Packages Go Vertical", IEEE Spectrum, pp. 46-51, August 2001.
    • (2001) IEEE Spectrum , pp. 46-51
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  • 21
    • 0033692511 scopus 로고    scopus 로고
    • Embedded-mask-methods for mm-scale multilayer vertical/slanted Si structures
    • Yoshio Mita, Makoto Mita, Agnes Tixier, Jean-Phillipe Gouy and Hiroyuki Fujita, "Embedded-Mask-Methods for mm-scale Multilayer Vertical/Slanted Si Structures", Proceedings of MEMS 2000, pp. 300-305, 2000.
    • (2000) Proceedings of MEMS 2000 , pp. 300-305
    • Mita, Y.1    Mita, M.2    Tixier, A.3    Gouy, J.-P.4    Fujita, H.5
  • 27
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    • Intellisense Corporation, "IntelliSuite User Manual", pp. 129-30, 1999.
    • (1999) IntelliSuite User Manual , pp. 129-130


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.