Suppression of inelastic deformation of nanocoated thin film microstructures

Journal of Applied Physics

Volumn 95, Issue 12, 2004, Pages 8216-8225

  Zhang, Yanhang ^a   Dunn, Martin L ^a   Gall, Ken ^a   Elam, Jeffrey W ^b   George, Steven M ^b  

^a University of Colorado   (United States)

^b UNIVERSITY OF COLORADO   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA NANOCOATINGS; ATOMIC LAYER DEPOSITION (ALD); MULTILAYER THIN FILMS; POLYSILICON FILM;

ALUMINA; CREEP; GOLD; INORGANIC COATINGS; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; PLASTIC FILMS; POLYSILICON; THERMOELASTICITY; THIN FILMS;

NANOSTRUCTURED MATERIALS;

EID: 3142565240     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1736329     Document Type: Article

References (30)

1. D. C. Miller, W. Zhang, and V. M. Bright, Sens. Actuators, A 89, 76 (2001).
2. D. J. Vickers-Kirby, R. L. Kubena, F. P. Stratton, R. J. Joyce, D. T. Chang, and J. Kim, Mater. Res. Soc. Symp. Proc. 67, EE2.5.1 (2001).
3. D. Weiss, H. Gao, and E. Arzt, Acta Mater. 49, 2395 (2001).
4. R. M. Keller, S. P. Baker, and E. Arzt, Acta Mater. 47, 415 (1999).
5. Y. L. Shen and S. Suresh, Acta Metall. Mater. 43, 3915 (1995).
6. M. D. Thouless, J. Cupta, and J. M. E. Harper, J. Mater. Res. 8, 1845 (1993).
7. M. D. Thouless, Annu. Rev. Mater. Sci. 25, 69 (1995).
8. M. D. Thouless, K. P. Rodbell, and C. Cabral, J. Vac. Sci. Technol. A 14, 2454 (1996).
9. Y. L. Shen and U. Ramamurty, J. Appl. Phys. 93, 1806 (2003).
10. Y. Zhang and M. L. Dunn, J. Mech. Phys. Solids (to be published).
11. D. A. Koester, R. Mahadevan, B. Hardy, and K. W. Markus, MUMPs™ Design Rules, Cronos Integrated Microsystems, A JDS Uniphase Company, 2001, http://www.memsrus.com/cronos/svcsrules.html
12. S. M. George, A. W. Ott, and J. W. Klaus, J. Phys. Chem. 100, 13121 (1996).
13. M. Ritala and M. Leskela, in Handbook of Thin Film Materials, edited by H. S. Nalwa (Academic, San Diego, 2001).
14. A. W. Ott, J. W. Klaus, J. W. Johnson, and S. M. George, Thin Solid Films 292, 135 (1997).
15. J. W. Elam, M. D. Groner, and S. M. George, Rev. Sci. Instrum. 73, 2981 (2002).
16. N. D. Hoivik, J. W. Elam, R. J. Linderman, V. M. Bright, S. M. George, and Y. C. Lee, Sens. Actuators, A 103, 100 (2003).
17. J. W. Elam and S. M. George, Chem. Mater. 15, 1020 (2003).
18. M. L. Dunn, Y. Zhang, and V. Bright, J. Microelectromech. Syst. 11, 372 (2002).
19. Y. Zhang and M. L. Dunn, J. Microelectromech. Syst. 12, 788 (2003).
20. W. D. Nix, Metall. Trans. A 20A, 2217 (1989).
21. J. Koike, S. Utsunomiya, Y. Shimoyama, K. Maruyama, and H. Oikawa, J. Mater. Res. 13, 3256 (1998).
22. S. P. Baker, A. Kretschmann, and E. Arzt, Acta Mater. 49, 2145 (2001).
23. M. Legros, K. J. Hemker, A. Gouldstone, S. Suresh, R.-M. Keller-Flaig, and E. Artz, Acta Mater. 50, 3435 (2002).
24. K. Gall, M. L. Dunn, Y. Zhang, and B. Corff, Mech. Mater. 36, 45 (2004).
25. W. N. Sharpe, in the MEMS Handbook, edited by M. Gad-el-Hak (CRC Press, Boca Raton, FL, 2002).
26. J. A. King, Materials Handbook for Hybrid Microelectronics (Teledyne Microelectronics, Los Angeles, 1988).
27. F. DelRio et al. (private communication).
28. J. Proost and F. Spaepen, J. Appl. Phys. 91, 204 (2002).
29. W. D. Callister, Materials Science and Engineering An Introduction (Wiley, New York, 1997).
30. K. Gall, N. West, K. Spark, M. L. Dunn, and D. Finch, Acta Mater. 52, 2133 (2004).