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Volumn , Issue , 2005, Pages 7-17
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The impact of scaling on interconnect reliability
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Author keywords
Diffusion barrier; Electromigration; Interconnect; Low k; Sidewall damage; Stress induced voiding; Sub 100 nm; TDDB
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Indexed keywords
DIFFUSION BARRIERS;
INTERCONNECT;
LOW-K;
SIDEWALL DAMAGE;
STRESS-INDUCED-VOIDING;
SUB-100 NM;
TDDB;
COPPER;
DIELECTRIC MATERIALS;
DIFFUSION;
ELECTRIC CURRENT CARRYING CAPACITY (CABLES);
ELECTRIC LINES;
ELECTROMIGRATION;
RELIABILITY;
STRESS ANALYSIS;
ELECTRIC POWER SYSTEM INTERCONNECTION;
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EID: 28744453587
PISSN: 15417026
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (16)
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References (88)
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