Diffusion barrier integrity and electrical performance of Cu/porous dielectric damascene lines

IEEE Electron Device Letters

Volumn 24, Issue 3, 2003, Pages 147-149

  Iacopi, F ^a,b   Tokei Zs ^a   Stucchi, M ^a   Lanckmans, F ^a,b   Maex, K ^a,b  

^a IMEC   (Belgium)

^b UNIVERSITY OF LEUVEN   (Belgium)

Author keywords

Diffusion barriers; Electric breakdown; Interconnects; Leakage current; Porous dielectrics

Indexed keywords

DIELECTRIC MATERIALS; DIFFUSION IN SOLIDS; ELECTRIC BREAKDOWN; LEAKAGE CURRENTS; POROUS MATERIALS; THERMAL STRESS;

DAMASCENE LINES; DIFFUSION BARRIER; ELECTRICAL STRESS; POROUS DIELECTRICS;

COPPER;

EID: 0037600582     PISSN: 07413106     EISSN: None     Source Type: Journal    
DOI: 10.1109/LED.2003.809535     Document Type: Letter

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