A damage mechanics-based fatigue life prediction model for solder joints

Journal of Electronic Packaging

Volumn 125, Issue 1, 2003, Pages 120-125

  Tang, Hong ^a   Basaran, Cemal ^b  

^a RENESAS TECHNOLOGY CORP   (Japan)

^b UNIVERSITY AT BUFFALO   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; DEGRADATION; ELECTRONICS PACKAGING; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; FRACTURE MECHANICS; HARDENING; KINEMATICS; TENSILE TESTING; THERMAL CYCLING; THERMAL LOAD; THERMODYNAMICS;

BALL GRID ARRAY; DAMAGE MECHANICS; FATIGUE LIFE PREDICTION MODEL; THERMOMECHANICAL LOADING; VISCOPLASTIC CONSTITUTIVE MODEL;

SOLDERED JOINTS;

EID: 0242688163     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1536171     Document Type: Article

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