Impact of temperature cycle profile on fatigue life of solder joints

IEEE Transactions on Advanced Packaging

Volumn 25, Issue 3, 2002, Pages 433-438

  Dishongh, Terry ^a   Basaran, Cemal ^b   Cartwright, Alexander N ^b   Zhao, Ying ^b,c   Liu, Heng ^b  

^a INTEL CORPORATION   (United States)

^b UNIVERSITY AT BUFFALO   (United States)

^c ANALOG DEVICES INC   (United States)

Author keywords

BGA packaging; Moir interferometry; Solder joints fatigue; Temperature cycle profile

Indexed keywords

FATIGUE OF MATERIALS; INTERFEROMETRY; LAPTOP COMPUTERS; SOLDERED JOINTS; TEMPERATURE MEASUREMENT; THERMAL CYCLING;

TEMPERATURE CYCLE PROFILES;

ELECTRONICS PACKAGING;

EID: 0036706203     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2002.806735     Document Type: Conference Paper

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