Evaluation of thermal-mechanical fatigue behavior for 62Sn-38Pb bulk solder

Experimental Techniques

Volumn 27, Issue 2, 2003, Pages 31-34

  Wang, X S ^a   Li, Y Q ^b   Yu, S W ^a  

^a TSINGHUA UNIVERSITY   (China)

^b University of South Carolina   (United States)

Author keywords

Bulk solder; Crack growth; Equivalent plastic strain; Stress strain; Thermal mechanical coupled loading

Indexed keywords

CRACK INITIATION; CRACK PROPAGATION; ELECTRONICS PACKAGING; SOLDERING ALLOYS; STRAIN; STRAIN GAGES; STRAIN HARDENING;

BULK SOLDER; EQUIVALENT PLASTIC STRAIN; THERMAL-MECHANICAL FATIGUE;

FATIGUE TESTING;

EID: 0037962894     PISSN: 07328818     EISSN: None     Source Type: Journal    
DOI: 10.1111/j.1747-1567.2003.tb00104.x     Document Type: Article

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