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International Journal of Damage Mechanics

Volumn 10, Issue 2, 2001, Pages 101-132

Micro-mechanics of fatigue damage in Pb-Sn solder due to vibration and thermal cycling

(3) Dasgupta, A a Sharma, P a Upadhyayula, K a

a UNIVERSITY OF MARYLAND (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CREEP; FATIGUE OF MATERIALS; GRAIN BOUNDARIES; LEAD ALLOYS; MATHEMATICAL MODELS; NUCLEATION; PLASTICITY; RELAXATION PROCESSES; STRESS ANALYSIS; THERMAL CYCLING; THERMAL EFFECTS; VIBRATIONS (MECHANICAL);

CYCLIC CREEP; CYCLIC PLASTICITY; DISLOCATION MECHANICS; SOLDER;

FRACTURE MECHANICS;

EID: 0035302174 PISSN: 10567895 EISSN: None Source Type: Journal
DOI: 10.1106/NM1B-1UQH-DJCT-4YH1 Document Type: Article

Times cited : (33)

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