Extending the fatigue life of solder grid array (SGA) electronic packages

Journal of Electronic Packaging

Volumn 125, Issue 1, 2003, Pages 18-23

  Larson, Michael C ^a   Verges, Melody A ^b  

^a Tulane University   (United States)

^b UNO College of Engineering   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK PROPAGATION; CYCLIC LOADS; FAILURE ANALYSIS; FATIGUE OF MATERIALS; FRACTURE MECHANICS; PRINTED CIRCUIT BOARDS; TEMPERATURE; THERMAL EXPANSION;

AXIAL FORCE; SOLDER GRID ARRAY; WARPING;

ELECTRONICS PACKAGING;

EID: 0344119465     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1520430     Document Type: Article

References (16)

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