Life prediction of solder joints by damage and fracture mechanics

Journal of Electronic Packaging, Transactions of the ASME

Volumn 118, Issue 4, 1996, Pages 193-200

  Ju, S H ^a   Sandor, B I ^b   Plesha, M E ^b  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^b University of Wisconsin Madison   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPY; COMPUTER SIMULATION; CONTINUUM MECHANICS; CRACK INITIATION; CRACK PROPAGATION; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; FRACTURE MECHANICS; JOINTS (STRUCTURAL COMPONENTS);

CONTINUUM DAMAGE MECHANICS; FATIGUE LIFE PREDICTION; SURFACE MOUNT TECHNOLOGY;

SOLDERED JOINTS;

EID: 0030378266     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792152     Document Type: Article

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