Measurement of residual stress and elastic modulus of polycrystalline 3C-SiC films deposited by low-pressure chemical vapor deposition

Thin Solid Films

Volumn 492, Issue 1-2, 2005, Pages 195-202

  Fu, Xiao An ^a   Dunning, Jeremy L ^a   Zorman, Christian A ^a   Mehregany, Mehran ^a  

^a Case Western Reserve University   (United States)

Author keywords

Chemical vapor deposition (CVD); Elastic properties; Silicon carbide; Stress

Indexed keywords

CHEMICAL VAPOR DEPOSITION; COMPRESSIVE STRESS; DIAPHRAGMS; ELASTIC MODULI; MICROMACHINING; POISSON RATIO; POLYCRYSTALLINE MATERIALS; RESIDUAL STRESSES; SILICON CARBIDE; STRAIN GAGES; TEXTURES;

BIAXIAL MODULUS; DEPOSITION PRESSURES; ELASTIC PROPERTIES;

THIN FILMS;

EID: 25844499734     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2005.07.236     Document Type: Article

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