Fundamentals of delamination initiation and growth in flip chip assemblies

Proceedings - Electronic Components and Technology Conference

Volumn 2, Issue , 2005, Pages 1172-1186

  Rahim, M Kaysar ^a,b   Suhling, Jeffrey C ^a   Jaeger, Richard C ^a   Lall, Pradeep ^a  

^a Department of Mechanical Engineering ^*

^b AUBURN UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DELAMINATION PROPAGATION; FLIP CHIP ASSEMBLIES; FLIP CHIP DIE;

ADHESION; DELAMINATION; DIES; FATIGUE OF MATERIALS; INTERFACES (MATERIALS); SOLDERED JOINTS; STRENGTH OF MATERIALS; STRESS CONCENTRATION; THERMAL CYCLING;

FLIP CHIP DEVICES;

EID: 24644478744     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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