Measurements and modeling of the temperature dependent material behavior of underfill encapsulants

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2003, Pages 1636-1643

  Islam, M Saiful ^a   Suhling, Jeffrey C ^a   Lall, Pradeep ^a   Xu, Baohua ^a   Johnson, R Wayne ^a  

^a AUBURN UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; FLIP CHIP DEVICES; OPTIMIZATION; STRAIN RATE; THERMAL CYCLING;

FLIP CHIP ASSEMBLIES; UNDERFILL ENCAPSULANTS; UNIAXIAL TENSION SPECIMENS;

ENCAPSULATION;

EID: 0038012189     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. Feustal, F., Wiese, S., and Meusal, E., "Time Dependent Material Modeling for Finite Element Analyses of Flip Chops, Proceedings of the 50th Electronic Components and Technology Conference, pp. 1548-1553, Las Vegas, NV, May 21-24, 2000.
2. Qian, Z., Lu, M., Wang, J., and Liu, S., "Testing and Constitutive Modeling of Thin Polymer Films and Underfills by a 6-Axis Submicron Tester," Applications of Experimental Mechanics to Electronic Packaging, pp. 105-112, ASME IMECE, Dallas, TX, Nov. 16-21, 1997.
3. Qian, Z., Wang, J., Yang, J., and Liu, S., "Visco-Elastic-Plastic Properties and Constitutive Modeling of Underfills," IEEE Transactions on Components and Packaging Technologies, Vol. 22(2), pp. 152-157, 1999.
4. Rao, Y., Shi, S. H., and Wong, C. P., "Improved Methodology for Determining Temperature Dependent Moduli of Underfill Encapsulants," IEEE Transactions on Components and Packaging Technologies, Vol. 23(3), pp. 434-439, 2000.
5. Shi, X. Q., Wang, Z. P., Pang, H. L. J., and Zhang, X. R., "Investigation of Effect of Temperature and Strain Rate on Mechanical Properties of Underfill Material by Use of Microtensile Specimens," Polymer Testing, Vol. 21, pp. 725-733, 2002.
6. Andersson, O. and Berkyto, E., "Some Factors Affecting the Stress Strain Characteristics of Paper," Svensk Papperstidning, Vol. 54(13), pp. 437-444, 1951.
7. Yeh, K. C., Considine, J. M., Suhling, J. C., "The Influence of Moisture Content on the Nonlinear Constitutive Behavior of Cellulosic Materials," Proceedings of the 1991 International Paper Physics Conference, TAPPI, pp. 695-711, Kona, Hawaii, September 22-26, 1991.