Analysis of interface delamination in flip-chip packages

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 1332-1337

  Mercado, Lei L ^a   Sarihan, Vijay ^a   Hauck, Torsten ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DELAMINATION; FAILURE ANALYSIS; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; FRACTURE MECHANICS; INTERFACES (MATERIALS); RELIABILITY; THERMAL EFFECTS;

FLIP CHIP PACKAGES; INTERFACE DELAMINATION; MECHANICAL LOADING; PLASTIC BALL GRID ARRAY;

ELECTRONICS PACKAGING;

EID: 0034476477     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)