Mechanical fatigue test method for chip/underfill delamination in flip-chip packages

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 25, Issue 3, 2002, Pages 217-222

  Hirohata, Kenji ^a   Kawamura, Noriyasu ^a   Mukai, Minoru ^a   Kawakami, Takashi ^a   Aoki, Hideo ^a   Takahashi, Kuniaki ^a  

^a TOSHIBA CORPORATION   (Japan)

Author keywords

Delamination; Flip chip package; Mechanical fatigue test; Reliability; Underfill resin

Indexed keywords

DELAMINATION; FATIGUE TESTING; INTEGRATED CIRCUIT TESTING; INTERFACES (MATERIALS); MARKOV PROCESSES; RELIABILITY; SOLDERING ALLOYS; STRESS ANALYSIS;

CHIP-UNDERFILL DELAMINATION; FLIP-CHIP PACKAGE; MECHANICAL FATIGUE TEST METHOD; UNDERFILL RESIN;

FLIP CHIP DEVICES;

EID: 0036665640     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2002.804617     Document Type: Article

References (6)

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