Underfill delamination analysis of flip chip on low-cost board

Advances in Electronic Materials and Packaging 2001

Volumn , Issue , 2001, Pages 280-285

  Cheng, Zhaonian ^a   Xu, Bulu ^a   Zhang, Qun ^a   Cai, Xia ^a   Huang, Weidong ^a   Xie, Xiaoming ^a  

^a SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; COST BENEFIT ANALYSIS; CRACK TIPS; CRACKS; DELAMINATION; ELECTRONICS PACKAGING; ENERGY RELEASE RATE; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; FRACTURE; MODIFIED ATMOSPHERE PACKAGING; STRAIN ENERGY; STRAIN RATE;

CONVEX SHAPES; DELAMINATION CRACK; DELAMINATION PROPAGATION RATE; EMPIRICAL EQUATIONS; FINITE ELEMENT SIMULATIONS; FLIP CHIP ASSEMBLIES; MECHANICAL METHODS; SOLDER JOINTS;

FAILURE (MECHANICAL);

EID: 1942492714     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2001.983998     Document Type: Conference Paper

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