Lifetime of solder joint and delamination in flip chip assemblies

Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability

Volumn , Issue , 2004, Pages 174-186

  Cheng, Zhaonian ^a,b  

^a SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY   (China)

^b CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; CRACK PROPAGATION; CRACKS; DELAMINATION; FATIGUE OF MATERIALS; FLIP CHIP DEVICES; MAXWELL EQUATIONS; MICROELECTRONICS; THERMAL CYCLING; THERMAL EXPANSION; VISCOPLASTICITY;

CONSTANT ELASTICITY (EC); FLIP-CHIP ON BOARD (FCOB) TECHNOLOGY; STRAIN ENERGY; THERMAL CYCLES;

SOLDERED JOINTS;

EID: 4544388261     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/beprl.2004.1308169     Document Type: Conference Paper

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