Measurement of backside flip chip die stresses using piezoresistive test die

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3906, Issue , 1999, Pages 298-303

  Suhling, Jeffrey C ^a   Johnson, R Wayne ^a   Mian, A K M ^a   Rahim, M Kaysar ^a   Zou, Yida ^a   Ragam, Srikanth ^a   Palmer, Michael ^a   Ellis, Charles D ^a   Jaeger, Richard C ^a  

^a AUBURN UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; CORRELATION METHODS; DIES; ELECTRONICS PACKAGING; FAILURE ANALYSIS; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; MECHANICAL VARIABLES MEASUREMENT; PIEZOELECTRICITY; RELIABILITY; THERMAL CYCLING;

FLIP CHIP DIE; LAMINATE SUBSTRATE; PIEZORESISTIVE TEST DIE; THERMAL CYCLING RELIABILITY TEST;

MICROELECTRONIC PROCESSING;

EID: 0033344349     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (17)