Investigation and Minimization of Underfill Delamination in Flip Chip Packages

IEEE Transactions on Device and Materials Reliability

Volumn 4, Issue 1, 2004, Pages 86-91

  Zhai, Charlie Jun ^a   Sidharth, ^a   Bush II, Richard C ^a   Master, Raj N ^a  

^a ADVANCED MICRO DEVICES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; FRACTURE TOUGHNESS; INTERFACES (MATERIALS); MICROCRACKS; MICROPROCESSOR CHIPS; SOLDERED JOINTS; SOLDERING; STRESS INTENSITY FACTORS; THERMAL EXPANSION;

COEFFICIENT OF THERMAL EXPANSION (CTE); DIRECT CHIP ATTACH (DCA) APPLICATIONS; FLIP CHIP PACKAGES; INTERFACIAL FRACTURE TOUGHNESS;

FLIP CHIP DEVICES;

EID: 2342512828     PISSN: 15304388     EISSN: None     Source Type: Journal    
DOI: 10.1109/TDMR.2003.822339     Document Type: Conference Paper

References (9)

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