Characterization of die stresses in flip chip on laminate assemblies using (111) silicon stress test chips

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2003, Pages 905-919

  Rahim, M Kaysar ^a   Suhling, Jeffrey C ^a   Copeland, D Scott ^a   Jaeger, Richard C ^a   Lall, Pradeep ^a   Johnson, R Wayne ^a  

^a AUBURN UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHARACTERIZATION; COMPUTER SIMULATION; DIES; ENCAPSULATION; FINITE ELEMENT METHOD; LAMINATES; MICROSCOPIC EXAMINATION; RELIABILITY; SENSORS; SILICON; STRESS CONCENTRATION; THERMAL CYCLING;

C MODE SCANNING ACOUSTIC MICROSCOPY; DIE STRESSES; SILICON STRESS TEST CHIPS; UNDERFILL CURE; UNDERFILL ENCAPSULANTS;

FLIP CHIP DEVICES;

EID: 0037674597     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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