Mechanism and growth rate of underfill delaminations in flip chips

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2001, Pages 98-103

  Jakschik, S ^a   Feustel, F ^a   Meusel, E ^a  

^a DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER AIDED SOFTWARE ENGINEERING; CRACK PROPAGATION; DELAMINATION; FAILURE ANALYSIS; INTERFACES (MATERIALS); MICROSCOPIC EXAMINATION; PASSIVATION; SEMICONDUCTING SILICON; THERMAL EXPANSION;

DELAMINATION INITIATION; GLASS CHIP; SCANNING ACOUSTIC MICROSCOPY; UNDERFILL DELAMINATION;

FLIP CHIP DEVICES;

EID: 0034822057     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. Qualifying flip-chip underfills
2. Numerical and experimental investigations of large IC flip chip attach
3. An analysis of interface delamination in flip-chip packages
4. The effect of underfill imperfections on the reliability of flip chip modules: FEM simulations and experiments
5. Influence of flux selection and underfill selection on the reliability of flip-chip on FR-4