Investigation of the underfill delamination and cracking in flip-chip modules under temperature cyclic loading

IEEE Transactions on Components and Packaging Technologies

Volumn 24, Issue 1, 2001, Pages 84-91

  Fan, X J ^b   Wang, H B ^c   Lim, T B ^a,d  

^a IEEE   (Singapore)

^b PHILIPS RESEARCH LABORATORIES   (Netherlands)

^c STMICROELECTRONICS   (Singapore)

^d INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

Cracking; Delamination; Finite element; Flip chip; Fracture mechanics; Singularity; Solder joint fatigue; Thermal cycling; Underfill

Indexed keywords

UNDERFILL DELAMINATION;

CRACK INITIATION; CYCLIC LOADS; DELAMINATION; FATIGUE OF MATERIALS; FILLERS; FINITE ELEMENT METHOD; FRACTURE MECHANICS; SOLDERED JOINTS; STRESS ANALYSIS; THERMAL CYCLING; THERMAL LOAD;

FLIP CHIP DEVICES;

EID: 0035280091     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.910806     Document Type: Article

References (9)

1. Reliability assessment of flip-chip and CSP
2. Thermal stresses in layered electronic assemblies
3. Effect of adhesion and delamination on stress singularities in plastic packaged integrated circuits
4. Investigation of stress singularity fields and stress intensity factors
5. Numerical stress analysis of resin cracking in LSI plastic packages under temperature cyclic loading
6. Mixed mode cracking in layered materials
7. Stress singularities resulting from various boundary conditions in angular comers of plates in extension
8. Elastic fracture concepts for interfacial cracks