Modeling interface fracture in flip chip assembly

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 1757-1761

  Pang, H L J ^a   Zhang, X R ^a   Shi, X Q ^a   Wang, Z P ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

FLIP CHIP BALL GRID ARRAYS (FCBGA);

CRACKS; DELAMINATION; FINITE ELEMENT METHOD; FRACTURE; INTERFACES (MATERIALS); THERMAL CYCLING;

FLIP CHIP DEVICES;

EID: 0036287842     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2002.1008349     Document Type: Conference Paper

References (7)

1. Reliability analysis of flip chip on board implementing fast-flow, snap-cure underfills
2. Effects of underfill delamination and chip size on the reliability of solder bumped flip chip on board
3. Fracture mechanics analysis of low cost solder bumped flip chip assemblies with imperfect underfills
4. Investigation of the underfill Delamination and cracking in flip-chip modules under temperature cyclic loading
5. Elastic fracture mechanics concepts for interfacial cracks
6. Interfacial fracture toughness test methodology for adhesive bonded joints
7. Interface fracture toughness test methodology for underfill encapsulant materials