Crosstalk reduction in mixed-signal 3-D integrated circuits with interdevice layer ground planes

IEEE Transactions on Electron Devices

Volumn 52, Issue 7, 2005, Pages 1459-1467

  Kim, Sang Kevin ^a   Liu, Christianto C ^a   Xue, Lei ^a   Tiwari, Sandip ^a  

^a Cornell University   (United States)

Author keywords

3 D integration; Coupling; Crosstalk; Ground plane; Isolation technology; Mixed signal circuits; Radio frequency (RF) isolation; System on chip (SoC) integration; Three dimensional (3 D) ICs

Indexed keywords

COMPUTER SIMULATION; CROSSTALK; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; MAXWELL EQUATIONS; MIXER CIRCUITS; SCATTERING PARAMETERS;

GROUND PLANE; ISOLATION TECHNOLOGY; MIXED SIGNAL CIRCUITS; RF ISOLATION; SYSTEM-ON-CHIP INTEGRATION; THREE DIMENSIONAL ICS; THREE DIMENSIONAL INTEGRATION;

MOSFET DEVICES;

EID: 23944523157     PISSN: 00189383     EISSN: None     Source Type: Journal    
DOI: 10.1109/TED.2005.850641     Document Type: Article

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