Heating effects of clock drivers in bulk, SOI, and 3-D CMOS

IEEE Electron Device Letters

Volumn 23, Issue 12, 2002, Pages 716-718

  Liu, Christianto C ^a   Zhang, Jifeng ^b   Datta, Ashim K ^b   Tiwari, Sandip ^a  

^a School of Operations Research and Industrial Engineering   (United States)

^b Department of Biological and Environmental Engineering   (United States)

Author keywords

Clock distribution; Finite element methods (FEMs); Heat dissipation; Silicon on insulator (SOI) technology; Thermal modeling; Three dimensional integrated circuits (3 DICs)

Indexed keywords

ELECTRIC CLOCKS; FINITE ELEMENT METHOD; HEAT LOSSES; INTEGRATED CIRCUIT MANUFACTURE; POWER ELECTRONICS; SILICON ON INSULATOR TECHNOLOGY; THERMAL EFFECTS; TRANSIENTS;

CLOCK DRIVERS; HEATING EFFECTS; THREE DIMENSIONAL INTEGRATED CIRCUITS;

CMOS INTEGRATED CIRCUITS;

EID: 0037005422     PISSN: 07413106     EISSN: None     Source Type: Journal    
DOI: 10.1109/LED.2002.805755     Document Type: Letter

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