Isolation in three-dimensional integrated circuits

IEEE Transactions on Microwave Theory and Techniques

Volumn 51, Issue 1 I, 2003, Pages 25-32

  Margomenos, Alexandros ^a   Herrick, Katherine Juliet ^b   Herman, Martin I ^c   Valas, Sam ^c   Katehi, Linda P B ^d  

^a UNIVERSITY OF MICHIGAN   (United States)

^b Raytheon RF Components   (United States)

^c CALIFORNIA INSTITUTE OF TECHNOLOGY   (United States)

^d PURDUE UNIVERSITY   (United States)

Author keywords

Finite ground coplanar (FGC) waveguide; Isolation; Micromachining; Packaging

Indexed keywords

COMPUTER SIMULATION; ELECTRIC CURRENTS; ELECTRIC NETWORK ANALYSIS; INTEGRATED CIRCUIT LAYOUT; MICROSTRIP LINES; MULTILAYERS; SEMICONDUCTOR DEVICE STRUCTURES; THREE DIMENSIONAL; WAVEGUIDES;

CIRCUIT ISOLATION; FINITE GROUND COPLANAR WAVEGUIDES; FINITE GROUND MICROSTRIP LINES; PARASITIC COUPLING; SOFTWARE PACKAGE HIGH FREQUENCY STRUCTURE SIMULATOR; SOFTWARE PACKAGE MAXWELL 2-D;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0037250352     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: 10.1109/TMTT.2002.806942     Document Type: Article

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