Reducing simultaneous switching noise and EMI on ground/power planes by dissipative edge termination

IEEE Transactions on Advanced Packaging

Volumn 22, Issue 3, 1999, Pages 274-283

  Novak, Istvan ^a  

^a SUN MICROSYSTEMS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRIC IMPEDANCE; ELECTROMAGNETIC WAVE INTERFERENCE; PRINTED CIRCUIT BOARDS; SPURIOUS SIGNAL NOISE;

SWITCHING NOISES;

ELECTRONICS PACKAGING;

EID: 0033310488     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.784475     Document Type: Article

References (25)

1. L. D. Smith, "Packaging and power distribution design considerations for a SUN microsystems desktop workstation," in Proc. 6th Topical Meeting Elect. Perform. Electron. Packag., Oct. 27-29, 1997, pp. 19-22.
2. R. Senthinathan, A. C. Cangellaris, and J. L. Prince, "Reference plane parasitics modeling and their contribution to the power and ground path 'effective' inductance as seen by the output drivers," IEEE Trans. microwave Theory Technol., vol. 42, pp. 1765-1773, Sept. 1994.
3. S. Ramo, J. R. Whinnery, and T. Van Duzer, Fields and Waves in Communication Electronics. New York: Wiley, 1994, ch. 9, pp. 464-467.
4. K. R. Carver, "A modal expansion theory for the microstrip antenna," in Proc. Dig. 1979 Int. Symp. Antennas Propagat., Univ. Washington, Seattle, WA, 1979, pp. 101-104.
5. K. R. Carver and J. W. Mink, "Microstrip antenna technology," IEEE Trans. Antennas Propagat., vol. AP-29, pp. 2-24, Jan. 1981.
6. N. Na and M. Swaminathan, "Modeling and simulation of planes in electronic packages for GHz systems," in Proc. 1999 Int. Conf. Comput. Design, Oct. 1999.
7. "SPRINT and SIGHTS simulation of power and ground distribution planes," High Design Technol., HOT Appl. Note 16, 1993.
8. K. Lee and A. Barber, "Modeling and analysis of multichip module power supply planes," IEEE Trans. Comp., Packag., Manufact. Technol. B, vol. 18, pp. 628-639, Nov. 1995.
9. C. B. O'Sullivan, L. D. Smith, and D. W. Forehand, "Developing a decoupling methodology with SPICE for multilayer printed circuit oards," in Proc. 1998 Int. Symp. Electromag. Compat., Denver, CO, Aug. 1998, pp. 562-565.
10. H. H. Wu, J. W. Meyer, K. Lee, and A. Barber, "Accurate power supply and ground plane pair models," in Proc. 7th Topical Meeting Elect. Perform. Electron. Packag., Oct. 26-28, 1998, pp. 163-166.
11. R. Koga, "Radiation from packaged integrated circuits," in Proc. 1994 EMC Symp., Sendai, Japan, May 16-20, 1994, pp. 581-584.
12. I. Novak, "Probes and setup for measuring power-plane impedances with vector network analyzer," in Proc. DesignCon 99, High-Performance Syst. Design Conf., Santa Clara, CA, Feb. 7, 1999, pp. 201-215.
13. R. Mittra, S. Chebolu, and W. D. Becker, "Efficient modeling of power planes in computer packages using the finite difference time domain method," IEEE Trans. Microwave Theory Tech., vol. 42, no. 9, pp. 1791-1795, Sept. 1994.
14. J. Franz and W. John, "An approach to determine decoupling effects of Vcc and Vgg structures in multilayer technique," in Proc. 1994 EMC Symp., Sendai, Japan, May 16-20, 1994, pp. 56-59.
15. W. D. Becker, J. Eckhardt, R. W. Frech, G. A. Katopis, E. Klink, M. F. McAllister, T. G. McNamara, P. Muench, S. R. Richter, and H. H. Smith, "Modeling, simulation, and measurement of mid-frequency simultaneous switching noise in computer systems," IEEE Trans. Comp., Packag., Manufact. Technol. B, vol. 21, pp. 157-163, May 1998
16. S. Van den Berghe, F. Olyslager, D. De Zutter, J. De Moerlose, and W. Temmerman, "Study of the ground bounce caused by power plane resonances," IEEE Trans. Electromagn. Compat., vol. 40, pp. 111-119, May 1998.
17. P. Wetmore, F. Chua, and X. Yuan, "Modeling simultaneous switching noise in high speed multilayer packages and printed circuit boards," in Proc. DesignCon 99, High-Performance Syst. Design Conf., Santa Clara, CA, Feb. 1-1, 1999.
18. J. Fang, D. Xue, and Y. Chen, "Effects of losses in power planes in the simulation of simultaneous switching noise," in Proc. 3rd Topical Meeting Elect. Perform. Electron. Packag., 1994, pp. 110-112.
19. J. Bandyopadhyay, P. Chahal, and M. Swaminathan, "Importance of damping and resonance in thin-film integrated decoupling capacitance ," in Proc. 6th Topical Meeting Elect. Perform. Elect. Packag., Oct. 27-29, 1997, pp. 31-34.
20. G. Lei, R. Techentin, and B. Gilbert, "Power distribution noise suppression using transmission line termination techniques," in Proc. 5th Topical Meeting Elect. Perform. Elect. Packag., Oct. 28-30, 1996, pp. 100-102.
21. G. E. Lichtenwalter and E. C. Miller, "Reduction of radio frequency emissions through terminating geometrically induced transmission lines in computer products," U.S. Patent 5266036, Nov. 30, 1993.
22. T. Morris, "AC coupled termination of a printed circuit board power plane in its characteristic impedance," U.S. Patent 5708400, Jan. 13, 1998.
23. I. Novak, "Reducing simultaneous switching noise and EMI on ground/power planes by dissipative edge termination," in Proc. 7th Topical Meeting Elect. Perform. Electron. Packag., Oct. 26-28, 1998, pp. 181-184.
24. T. Roy and L. Smith, "ESR and ESL of ceramic capacitor applied to decoupling applications," in Proc. 7th Topical Meeting Elect. Perform. Electron. Packag., Oct. 26-28, 1998, pp. 213-216.
25. T. Lenihan, L. Schaper, G. Morcan, K. Fairchild, and P. Parkerson, "Embedded thin film resistors, capacitors, and inductors in flexible polyimide films," Int. J. Microcirc. Electron. Packag., vol. 20, no. 4, pp. 474-481, 1997.