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Volumn 399, Issue 1-2, 2005, Pages 92-98

High spatial resolution stress measurements using synchrotron based scanning X-ray microdiffraction with white or monochromatic beam

(3) Tamura, N a Padmore, H A a Patel, J R a

a LAWRENCE BERKELEY NATIONAL LABORATORY (United States)

Author keywords

Electronic packaging; Stress measurements; Thin films; X ray microdiffraction

Indexed keywords

BUCKLING; CRYSTAL WHISKERS; MONOCHROMATORS; POLYCRYSTALLINE MATERIALS; STRAIN; SYNCHROTRONS; THIN FILMS; X RAY DIFFRACTION ANALYSIS; X RAY OPTICS;

MONOCHROMATIC BEAMS; STRESS MEASUREMENTS; X-RAY FOCUSING OPTICS; X-RAY MICRODIFFRACTION;

STRESS ANALYSIS;

MEASUREMENT METHOD;

EID: 23444432468 PISSN: 09215093 EISSN: None Source Type: Journal
DOI: 10.1016/j.msea.2005.02.033 Document Type: Article

Times cited : (54)

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