X-ray microdiffraction study of Cu interconnects

Applied Physics Letters

Volumn 76, Issue 3, 2000, Pages 315-317

  Zhang, X ^a   Solak, H ^a   Cerrina, F ^a   Lai, B ^b   Cai, Z ^b   Ilinski, P ^b   Legnini, D ^b   Rodrigues, W ^b  

^a UNIVERSITY OF WISCONSIN MADISON   (United States)

^b ARGONNE NATIONAL LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0000032751     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.125731     Document Type: Article

References (24)

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