Characterization of structural films using microelectromechanical resonators

Fatigue and Fracture of Engineering Materials and Structures

Volumn 28, Issue 8, 2005, Pages 711-721

  Muhlstein, Christopher L ^a  

^a PENNSYLVANIA STATE UNIVERSITY   (United States)

Author keywords

Fatigue; Reaction layer fatigue; Silicon; Thin films

Indexed keywords

CRACK PROPAGATION; FATIGUE OF MATERIALS; FATIGUE TESTING; FRACTURE MECHANICS; MICROELECTROMECHANICAL DEVICES; OSCILLATORS (ELECTRONIC); RESONATORS; SCANNING ELECTRON MICROSCOPY; STRESS ANALYSIS; STRESSES; THIN FILMS; TRANSMISSION ELECTRON MICROSCOPY;

HIGH VOLTAGE TRANSMISSION ELECTRON MICROSCOPY; MICROELECTROMECHANICAL RESONATORS; REACTION LAYER FATIGUE; SILICON FILMS; STRUCTURAL FILMS;

POLYSILICON;

EID: 22544450797     PISSN: 8756758X     EISSN: None     Source Type: Journal    
DOI: 10.1111/j.1460-2695.2005.00921.x     Document Type: Review

References (52)

1. Ritchie, R. O. (1999) Mechanisms of fatigue-crack propagation in ductile and brittle solids. Int. J. Fract. 100, 55-83.
2. Suresh, S. (1998) Fatigue of Materials, 2nd ed. Cambridge University Press, Cambridge, England.
3. Ritchie, R. O. and Dauskardt, R. H. (1991) Cyclic fatigue of ceramics: A fracture mechanics approach to subcritical crack growth and life prediction. J. Ceram. Soc. Jpn 99, 1047-1062.
4. Saxena, A. and Muhlstein, C. L. (1996) ASM Handbook (Edited by S. R. Lampman) Vol. 19. ASM International, Materials Park, OH, (Fracture and Fatigue).
5. Muhlstein, C. L., Brown, S. B. and Ritchie, R. O. (2001) High-cycle fatigue and durability of polycrystalline silicon films in ambient air. Sensors Actuators A 94, 177-188.
6. Kahn, H., Ballarini, R., Mullen, R. L. and Heuer, A. H. (1999) Electrostatically actuated failure of microfabricated polysilicon fracture mechanics specimens. Proc. R. Soc. A 455, 3807-3823.
7. Kapels, H., Aigner, R. and Binder, J. (1999) Fracture strength and fatigue of polysilicon determined by a novel thermal actuator. IEEE Trans. Elect. Dev. 47, 1522-1528.
8. Stanzl-Tschegg, S. and Mayer, H. (2001) Proceedings of the International Conference on Fatigue in the Very High Cycle Regime. (Edited by S. Stanzl-Tschegg and H. Mayer).
9. Mayer, H. (1999) Fatigue crack growth and threshold measurements at very high frequencies. Int. Mater. Rev. 44, 1-34.
10. Brown, S. B., Van Arsdell, W. and Muhlstein, C. L. (1997) Proceedings of International Solid State Sensors and Actuators Conference (Transducers '97). (edited by S. Senturia). IEEE, pp. 591-593.
11. Van Arsdell, W. (1997) Ph.D. Dissertation, Massachusetts Institute of Technology.
12. Van Arsdell, W. W. and Brown, S. B. (1999) Subcritical crack growth in silicon MEMS. J. Microelectromech. Sys. 8, 319-327.
13. Muhlstein, C. L., Brown, S. B. and Ritchie, R. O. (2000) Materials Science of Microelectromechanical System (MEMS) Devices III, MRS Fall Meeting (Edited by H. Kahn, de Boer, M., Judy, M. and Spearing, S. M.). Materials Research Society, EE5.8.1-EE5.8.6.
14. Muhlstein, C. L., Brown, S. B. and Ritchie, R. O. (2001) High-cycle fatigue of single crystal silicon thin films. J. Microelectromech. Sys. 10, 593-600.
15. Muhlstein, C. L., Stach, E. A. and Ritchie, R. O. (2002) Mechanism of fatigue in micron scale films of polycrystalline silicon for microelectromechanical systems. Appl. Phys. Lett. 80, 1532-1534.
16. Muhlstein, C. L., Stach, E. A. and Ritchie, R. O. (2002) A reaction-layer mechanism for the delayed failure of micron-scale polycrystalline silicon structural films subjected to high-cycle fatigue loading. Acta Mater. 50, 3579-3595.
17. Allameh, S. M., Gally, B., Brown, S. and Soboyejo, W. O. (2000) Materials Science of Microelectromechanical System (MEMS) Devices III (Edited by H. Kahn, de Boer, M., Judy, M. and Spearing, S. M.). MRS, EE2.3.1-EE2.3.6.
18. French, A. P. (1971) Vibrations and Waves. Norton, New York.
19. Noda, N. A., Sera, M. and Takase, Y. (1995) Stress concentration factors for round and flat test specimens with notches. Int. J. Fatigue 17, 163-178.
20. Pierron, O. N. and Muhlstein, C. L. (2005) Long-term reliability of single-crystal silicon thin films: the influence of environment on the fatigue damage accumulation rate. TMS Annual Meeting: Mechanical Properties of Thin Films and Small Structures San Francisco, CA, USA.
21. Kahn, H., Tayebi, N., Ballarini, R., Mullen, R. L. and Heuer, A. H. (2000) Fracture toughness of polysilicon MEMS devices. Sensors Actuators A A82, 274-280.
22. Chen, T.J. and Knapp, W.J. (1980) The fracture of single-crystal silicon under several liquid environments. J. Am. Ceram. Soc. 63, 225-226.
23. Lawn, B. R., Marshall, D. B. and Chantikul, P. (1981) Mechanics of strength-degrading contact flaws in silicon. J. Mater. Sci. 16, 1769-1775.
24. Wong, B. and Holbrook, R.J. (1987) Microindentation for fracture and stress-corrosion cracking studies in single-crystal silicon. J. Electrochem. Soc. 134, 2254-2256.
25. Connally, J. A. and Brown, S. B. (1992) Slow crack growth in single-crystal silicon. Science 256, 1537-1539.
26. Tabib-Azar, M., Wong, K. and Wen, K. (1992) Aging phenomena in heavily doped (p/sup +/) micromachined silicon cantilever beams. Sensors Actuators A 33, 199-206.
27. Muhlstein, C. and Brown, S. (1997) In: Proceedings of the NSF/AFOSR/ ASME Workshop on Tribology Issues and Opportunities in MEMS. (Edited by B. Bhushan). Kluwer Academic, p. 80.
28. Komai, K., Minoshima, K. and Inoue, S. (1998) Fracture and fatigue behavior of single crystal silicon microelements and nanoscopic AFM damage evaluation. Micros. Tech. 5, 30-37.
29. Minoshima, K., Terada, T. and Komai, K. (2000) Influence of nanometre-sized notch and water on the fracture behaviour of single crystal silicon microelements. Fatigue Fract. Engng Mater. Struct. 23, 1033-1040.
30. Kato, N. I., Nishikawa, A. and Saka, H. (2001) Dislocations in Si generated by fatigue at room temperature. Materials Science in Semiconductor Processing 4, 113-115.
31. Allameh, S. M., Gally, B., Brown, S. and Soboyejo, W. O. (2001) Mechanical Properties of Structural Films, STP 1413. (Edited by C. Muhlstein and Brown S). Vol. 1413. American Society for Testing and Materials, West Conshohocken, PA.
32. Ando, T., Shikida, M. and Sato, K. (2001) Tensile-mode fatigue testing of silicon films as structural materials for MEMS. Sensors Actuators A (Phy.), 93, 70-75.
33. Lee, S-H, Kim, J. S., Evans, J. W., Son, D., Pak, Y. E., Jeon, J. U. and Kwon, D. (2001) Evaluation of microfracture toughness and microcracking with notch tip radius of Si film structure for microactuator in hard disk drives. Micros. Tech. 7, 91-98.
34. Bagdahn, J., Schischka, J., Petzold, M. and Sharpe, W. N., Jr. (2001) Fracture toughness and fatigue investigations of polycrystalline silicon. In: Proceedings of the SPIE-The International Society for Optical Engineering. 4558, pp. 159-168.
35. Bagdahn, J. and Sharpe, W. N. J. (2002) MEMS 2002, IEEE, pp. 447-450.
36. Bagdahn, J. and Sharpe, W. N. (2003) Fatigue of polycrystalline silicon under long-term cyclic loading. Sensors Actuators A: Phys. 103, 9-15.
37. Sundararajan, S. and Bhushan, B. (2002) Development of AFM-based techniques to measure mechanical properties of nanoscale structures. Sensors Actuators A [Phys.] 101, 338-351.
38. Kahn, H., Ballarini, R., Bellante, J. J. and Heuer, A. H. (2002) Fatigue failure in polysilicon not due to simple stress corrosion cracking. Science 298, 1215-1218.
39. Kahn, H., Ballarini, R. and Heuer, A. H. (2002) Materials Research Society.
40. Dauskardt, R. H. (1993) A frictional-wear mechanism for fatigue-crack growth in grain bridging ceramics. Acta Metal. Mater. 41, 2765-2781.
41. Lathabai, S., Rödel, J. and Lawn, B. R. (1991) Cyclic fatigue from frictional degradation at bridging grains in alumina. J. Am. Ceram. Soc. 74, 1340-1348.
42. Gilbert, C. J., Cao, J. J., Moberly-Chan, W. J., DeJonghe, L. C. and Ritchie, R. O. (1996) Cyclic fatigue and resistance-curve behavior of an in situ toughened silicon carbide with Al-B-C additions. Acta Mater. 44, 3199-3214.
43. Asoo, B., McNaney, J. M., Mitamura, Y. and Ritchie, R. O. (2000) Cyclic fatigue-crack propagation in sapphire in air and simulated physiological environments. J. Biomed. Mater. Res. 52, 488-491.
44. Chen, C. P. and Leipold, M. H. (1980) Fracture toughness of silicon. Amer. Cer. Soc. Bull. 59, 469-472.
45. Ballarini, R., Mullen, R. L., Yin, Y., Kahn, H., Stemmer, S. and Heuer, A. H. (1997) The fracture toughness of polysilicon microdevices: A first report. Adv. Appl. Mech. 12, 915-922.
46. Lawn, B. R., Hockey, B.J. and Wiederhorn, S. M. (1980) Atomically sharp cracks in brittle solids: An electron microscopy study. J. Mater. Sci. 15, 12.
47. Chiao, Y. H. and Clarke, D. R. (1989) Direct observation of dislocation emission from crack tips in silicon at high temperatures. Acta Metal., 37, 203-219.
48. Dill, S. J., Bennison, S. J. and Dauskardt, R. H. (1997) Subcritical crack-growth behavior of borosilicate glass under cyclic loads: Evidence of a mechanical fatigue effect. J. Am. Ceram. Soc. 80, 773-776.
49. Wilson, B. A. and Case, E. D. (1997) In situ microscopy of crack healing in borosilicate glass. J. Mater. Sci. 32, 3163-3175.
50. Wilson, B. A. and Case, E. D. (1999) Effect of humidity on crack healing in glass from in-situ investigations using an ESEM. J. Mater. Sci. 34, 247-250.
51. Beuth, J. L., Jr. (1992) Cracking of thin bonded films in residual tension. Int. J. Sol. Struct. 29, 1657-1675.
52. Muhlstein, C. L. and Ritchie, R. O. (2003) High-cycle fatigue of micron-scale polycrystalline silicon thin films: fracture mechanics analyses of the role of the silicon/silica interface. Int. J. Fract. 119/120, 449-474.